Electroplating assisted diffusion bonding of ZrC–SiC composite for full ceramic joints

Approaches for Evaluating and Engineering Resilient Superhydrophobic Materials

“…Electroplating has also been used to fabricate highly robust coatings on to conductive substrates. The electroplating techniques can provide strong underlying connection to the substrate [85,86]. Highly rough surface features have been reported via numerous literature electroplating routes, with superhydrophobicity resulting from the addition of a hydrophobic surface coating [87].…”

Brazing of ZrB2–SiC–C ceramic and GH99 superalloy to form reticular seam with low residual stress

“…However, more attention has been paid to the joining of ZrB 2 base ceramics and only a few studies on UHTCs like ZrC base [11][12][13], HfC base [13,14] and HfB 2 base [15,16] ceramics have been reported. Brazing, diffusion bonding [11,12], transient-liquidphase (TLP) bonding [13][14][15] and inorganic glass interlayer joining [17] methods have been explored to join UHTCs. Brazing, due to its few limits of joints structure and joining pressure, has become the most explored method for joining UHTCs for practical applications.…”

Diffusion bonding and interfacial microstructure analysis of AlMgB14–TiB2 to Nb

“…Therefore, it is necessary to bond the ceramics and metals together to meet the engineering requirements. Hence, many joining technologies have been developed to accomplish the metal-ceramic bonding, such as fusion bonding [13], diffusion bonding [14][15][16][17], electroplating assisted diffusion bonding [18], transient liquid phase diffusion bonding (TLP) [19,20], sol-gel assisted in situ reaction bonding [21], ultrasonic-assisted bonding [22] and so on.…”