“…With the increasingly severe service conditions of microdevices, the requirements for the performance of the thin-film materials have gradually increased, leading to extensive applications such as nonenzyme glucose sensors [1], highstrength and high-conductivity films [2], antibacterial films [3], semiconductor interconnect [4], wear-resistant films [5], packaging film materials [6] and so on. There are many methods to prepare thin films, such as electrical deposition [7], arc evaporation [8], wet-laid and spunlace process [9], arc discharge [10] and son on [11], but these methods are not suitable for preparing low solid solubility alloy films. Magnetron sputtering has become an important method for preparing thin films due to its fast speed and good uniformity [12].…”