2016
DOI: 10.1109/ted.2016.2591767
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Electrothermal Effects on Hot-Carrier Reliability in SOI MOSFETs—AC Versus Circuit-Speed Random Stress

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Cited by 27 publications
(23 citation statements)
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“…The drift‐diffusion equations can be used to describe particles or carrier transport in various kinds of large‐scale electronic devices . However, the drift‐diffusion equations cannot be directly discretized because of certain convergence problem.…”
Section: Modeling and Simulation Approachmentioning
confidence: 99%
See 3 more Smart Citations
“…The drift‐diffusion equations can be used to describe particles or carrier transport in various kinds of large‐scale electronic devices . However, the drift‐diffusion equations cannot be directly discretized because of certain convergence problem.…”
Section: Modeling and Simulation Approachmentioning
confidence: 99%
“…However, the drift‐diffusion equations cannot be directly discretized because of certain convergence problem. Therefore, Schffetter‐Gummel discretization is usually used to overcome this problem . Taking electron transport for example as below.…”
Section: Modeling and Simulation Approachmentioning
confidence: 99%
See 2 more Smart Citations
“…As well, they proposed that the short-channel effect of SOI MOSFETs can be improved by applying a reverse bias to the substrate to push the inversion channel from the back surface to the front. Further, Chen et al [18] have studied the electrothermal effects on hot-carrier injection (HCI) in 100-nm silicon-on-insulator (SOI) MOSFET for a digital integrated circuit. They proved that the buried oxide layer leads to a high temperature in the channel and deteriorates the HCI.…”
Section: ) Introductionmentioning
confidence: 99%