Electrothermally activated SU-8 microgripper for single cell manipulation in solution

Chronis, Nikos; Lee, L.P.

doi:10.1109/jmems.2005.845445

Cited by 355 publications

(244 citation statements)

References 29 publications

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“…However, their applications in high speed wire bonding are limited due to a complex fabrication and assembly process as well as their poor anti-jamming characteristics 13 . Electrostatic and electrothermal actuators have been used in microgrippers, but these grippers usually generate a very low grasping force, and thus are not suitable for wire bonding [14][15][16] . Shape memory alloy actuators can produce large strokes.…”

Section: Introductionmentioning

confidence: 99%

A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

Liang

Wang

Tian

et al. 2015

Review of Scientific Instruments

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Placid. (2015) A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging. Review of Scientific Instruments, 86 (4). 045106. Permanent WRAP url: http://wrap.warwick.ac.uk/76447 Copyright and reuse:The Warwick Research Archive Portal (WRAP) makes this work by researchers of the University of Warwick available open access under the following conditions. Copyright © and all moral rights to the version of the paper presented here belong to the individual author(s) and/or other copyright owners. To the extent reasonable and practicable the material made available in WRAP has been checked for eligibility before being made available.Copies of full items can be used for personal research or study, educational, or not-for profit purposes without prior permission or charge. Provided that the authors, title and full bibliographic details are credited, a hyperlink and/or URL is given for the original metadata page and the content is not changed in any way. Publisher's statement:Copyright ( A note on versions:The version presented here may differ from the published version or, version of record, if you wish to cite this item you are advised to consult the publisher's version. Please see the 'permanent WRAP url' above for details on accessing the published version and note that access may require a subscription.A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging A novel monolithic piezoelectric actuated wire clamp is presented in this paper to achieve fast, accurate and robust microelectronic device packaging. The wire clamp has compact flexure-based mechanical structure and light weight. To obtain large and robust jaw displacements and ensure parallel jaw grasping, a two-stage amplification composed of a homothetic bridge type mechanism and parallelogram leverage mechanism was designed. Pseudo-rigid-body model (PRBM) and Lagrange approaches were employed to conduct the kinematic, static and dynamic modeling of the wire clamp, and optimization design was carried out. The displacement amplification ratio, maximum allowable stress and natural frequency were calculated. Finite element analysis (FEA) was conducted to evaluate the characteristics of the wire clamp and wire Electro Discharge Machining (EDM) technique was utilized to fabricate the monolithic structure. Experimental tests were carried out to investigate the performance, and the experimental results match well with the theoretical calculation and FEA.The amplification ratio of the clamp is 20.96, and the working mode frequency is 895 Hz.Step response test show the wire clamp has fast response and high accuracy, and the motion resolution is 0.2μm. High speed precision grasping operations of gold and copper wires were realized using the wire clamper.

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Section: Introductionmentioning

confidence: 99%

A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

Liang

Wang

Tian

et al. 2015

Review of Scientific Instruments

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“…With tip temperatures approximated to 100 °C, the gripper design remained unsuitable for oocyte manipulation as the enzymes would be denatured [7]. Lower temperature operation, in the range of 10-32 °C, was achieved in [8] but only at deflections of up to 12 μm. Further work was done on attempting to balance low operating temperatures with large maximum deflection, including [9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

The static and dynamic response of SU-8 electrothermal microgrippers of varying thickness

Dodd

Ward

Cooke

et al. 2015

Microelectronic Engineering

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Publisher's copyright statement: NOTICE: this is the author's version of a work that was accepted for publication in the Journal of microelectronic engineering. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be re ected in this document. Changes may have been made to this work since it was submitted for publication. A de nitive version was subsequently published in the Journal of microelectronic engineering, 145, 2015, 10.1016/j.mee.2015.03.028 Additional information: Use policyThe full-text may be used and/or reproduced, and given to third parties in any format or medium, without prior permission or charge, for personal research or study, educational, or not-for-pro t purposes provided that:• a full bibliographic reference is made to the original source • a link is made to the metadata record in DRO • the full-text is not changed in any way The full-text must not be sold in any format or medium without the formal permission of the copyright holders.Please consult the full DRO policy for further details. AbstractThis work presents an investigation into the effect on dynamic response of SU-8 microgrippers due to varying thickness, and subsequent validation via COMSOL Multiphysics simulations and thermal camera profiling during actuation. The tweezer-like microgrippers can easily manipulate, with a high degree of control, cells and particles with diameters as small as 10 µm, without using an impractical operating voltage or generating excessive heat. However, in order to fully exploit the versatility of the devices, their response characteristics must be fully understood as material and/or dimension parameters change. Therefore an investigation took place to determine the effects of device thickness on functionality of the device, including the drive current required to actuate the gripper and the speed of actuation. Furthermore, an infrared camera was used to characterize the thermal response of the device. Finally, a simulation of the temperature profile and deflection dimension has been developed in order to verify the findings and further investigate and predict the effects of design variations.

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“…The thermal actuator can be categorized as in-plane and out of plane actuator [10], [11], where driving mechanism behind the two type of actuator is hot (narrow arm) and cold (wider arms) beam actuation and bimorph actuation. The potential application of electrothermal actuators includes optical switching [12], [13] and microgrippers [14] and micro robotic application [15].…”

Section: Introductionmentioning

confidence: 99%

Design and Validation of Silicon-on-Insulator Based U Shaped Thermal Microactuator

Kumar¹,

Sharma²

2014

IJMMM

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Abstract-This paper presents design and fabrication of a MEMS thermal actuator using SOI technology. The thermal actuators are used in, micro grippers, micro mirror and switching applications by applying voltage on different contact pads, causing beams with pseudo bimorph characteristics heated, thereby the microactuator can produce lateral motion in plane or out of plane. The narrow or hot arm heats up and expands more than the wide or cold arm deflecting the device toward the cold arm. Thermal actuators are more power efficient than electrostatic actuators. The present work carries the design, fabrication and characterization of the thermal actuator wherein numerical simulation are carried out in COMSOL multiphysics tool and fabrication was done at MUMPS facility MEMSCAP. The simulated results on displacement versus voltage are verified experimentally.

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Electrothermally activated SU-8 microgripper for single cell manipulation in solution

Cited by 355 publications

References 29 publications

A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

The static and dynamic response of SU-8 electrothermal microgrippers of varying thickness

Design and Validation of Silicon-on-Insulator Based U Shaped Thermal Microactuator

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