Embedded capacitors in the next generation processor

Min, Yo‐Sep; Olmedo, Reynaldo; Hill, Michael J.; Radhakrishnan, Kaladhar; Aygün, Kemal; Kabiri-Badr, Mostafa; Panat, Rahul; Dattaguru, Sriram; Balkan, H.

doi:10.1109/ectc.2013.6575731

Cited by 20 publications

(8 citation statements)

References 1 publication

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“…Min et al [120] discuss the use of capacitors embedded into substrates to reduce the overall size of the substrate. Although this change may meet the market need for smaller components, it will add additional complexity to the disassembly phase of WEEE and is likely to lead to an increased loss of materials to landfill or energy recovery by incineration.…”

Section: Impacts Of End Of Life Methodsmentioning

confidence: 99%

Life cycle assessment and environmental profile evaluations of high volumetric efficiency capacitors

et al. 2018

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High volumetric efficiency capacitors are found in all smart electronic devices, providing important applications within circuits, including flexible filter options, power storage and sensing, decoupling and circuit smoothing functions. Multilayer ceramic capacitors (MLCCs) hold the major market share but tantalum electrolytic capacitors (TECs) provide a viable alternative if higher breakdown strengths are required. The reduced costs, smaller dimensions suitable for spaceconstrained electronic circuits, exceptional high-frequency characteristics, higher reliability, ripple control and longevity, however, are driving the market to replace TECs with MLCCs wherever possible. To date, no current research regarding the transition from TECS to MLCCs has been conducted from an entirely environmental viewpoint. This article identifies, quantifies, ranks and compares the environmental impacts of the MLCC and TEC supply chains using an integrated hybrid life cycle assessment framework. Three recovery methods: incineration; hydrometallurgy and pyrometallurgy are considered in the overall impact assessment. Electrical energy consumption during fabrication alongside the use of nickel paste are the major environmental hotspot for MLCCs. The high proportion of tantalum in TECs results in an overall greater environmental impact in comparison with MLCCs, due to intensive extraction, processing and purification requirements of tantalum. Of the three recovery methods, the hydrometallurgy process offers the least environmental impact for both MLCCs and TECs. Overall, the current work shows that while the industry led transition from TECs to MLCCs offers both an operational and functional edge, it is also an environmentally intelligent move. Intervention options that can further drive down the environmental impacts of MLCCs are also proposed such as a reduction in the reliance of MLCCs on rare earth elements and Cu external electrodes in some designs and material recovery.

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Section: Impacts Of End Of Life Methodsmentioning

confidence: 99%

Life cycle assessment and environmental profile evaluations of high volumetric efficiency capacitors

et al. 2018

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“…However, these technologies have hindrance due to cost, complicated processing steps and ESL due to long current path thus making these technologies less viable. Recently Intel has developed the technology to embed a passive capacitor in the printed circuit board right under the semiconductor chip and connected through via-hole which has reduced the current path to some extent [3], however still have some current path and contact resistance. Moreover, discrete decoupling capacitors available in the market have lower specific capacitance 3.7 pF/lm 2 [4,5] and are connected in parallel to achieve the required capacitance but at the cost of noise.…”

Section: Introductionmentioning

confidence: 99%

CMOS compatible on-chip decoupling capacitor based on vertically aligned carbon nanofibers

Saleem

Göransson

Desmaris³

et al. 2015

Solid-State Electronics

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“…In electronic packaging, capacitors as the most commonly used passive component, are directly mounted on the substrate to maintain the voltage across all operating frequencies [22]. The reduction of capacitor dimension results in the challenge of handling and assembling capacitors [23].…”

Section: Introductionmentioning

confidence: 99%

Reliability and prediction of Sn36Pb2Ag solder joints under thermal aging test

Cong

Liu

Wang

et al. 2023

Mater. Res. Express

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In this work, the capacitor solder joints were aged at 50 ℃, 75 ℃, 100 ℃, 125, and 150 ℃ from 100 h to 1000 h. The intermetallic compounds (IMCs) layer growth of Sn36Pb2Ag on hot air solder leveled (HASL) pad and electroless nickel/immersion gold (ENIG) pad was measured. Based on the empirical power-law of the IMC growth and the Arrhenius relationship between diffusion coefficient and aging temperature, a method to predict the IMC growth at a selected temperature was developed. The mechanical property of capacitor solder joints after thermal aging was investigated through the shear test. Through analysis of the fracture surface, the mixed fracture mode of ductile and brittle was exhibited. The porous structure of the Cu coating on the capacitor electrode was determined to be the origin of the crack.

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Embedded capacitors in the next generation processor

Cited by 20 publications

References 1 publication

Life cycle assessment and environmental profile evaluations of high volumetric efficiency capacitors

Life cycle assessment and environmental profile evaluations of high volumetric efficiency capacitors

CMOS compatible on-chip decoupling capacitor based on vertically aligned carbon nanofibers

Reliability and prediction of Sn36Pb2Ag solder joints under thermal aging test

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