Embedded cooling technologies for densely integrated electronic systems

Sarvey, Thomas E.; Zhang, Yang; Zheng, Li; Thadesar, Paragkumar A.; Gutala, Ravi; Cheung, Colman; Rahman, Arifur; Bakir, Muhannad S.

doi:10.1109/cicc.2015.7338365

Cited by 26 publications

(5 citation statements)

References 8 publications

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“…As dies are getting smaller and are beginning to be stacked, it limits the contact area most cooling solutions have between the IC and heatsink as only the top surface of one die in the stack will be in contact. Microfluidic channels, however, still have very good contact with the die as they are built into each individual die in the stack [6]. Although microfluidic channels have high cooling rate implications, they do not use TIMs and so go beyond the scope of this meta-study.…”

Section: Introductionmentioning

confidence: 99%

A Meta-study on the Thermal Properties of Carbon Nanotubes in Thermal Interface Materials

Clarkson¹,

Khan²,

Singh³

2019

PAMR

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Computer Integrated Circuit (IC) microprocessors are becoming more powerful and densely packed while cooling mechanisms are seeing an equivalent improvement to compensate. A significant limit to cooling performance is thermal transfer between die and heatsink. In this meta study we evaluate carbon nanotube (CNT) thermal interface materials (TIMs) in order to determine how to maximise thermal transfer efficiency. We gathered information from over 15 articles focused on the thermodynamic parameters of CNT TIMs from databases such as Scopus, IEEE Xplore and ScienceDirect. Articles were filtered by key words including ‘carbon nanotubes’ and ‘thermal interface materials’ to identify scientific articles relevant to our research on TIMs. From our meta study we have found that enhancing CNTs will provide the best improvement in TIMs. The parameters analysed to determine TIM performance included thermal resistance, thermal conductivity and the effect of CNT concentration on computer operation time. Through our investigation we understood that increasing the concentration of CNT from 0 to 2 wt % increases the operation time from 75 seconds at 66°C to 200s at 63°C as well as increasing the thermal conductivity by 1.82 times for the AS5 thermal paste with 2 wt % CNT. Furthermore, CNT TIM pastes with less thickness have a lower thermal resistance of 0.4 K/W. However not all these parameters have been tested with computer chips. This means that in order to increase current heat transfer efficiency limit, we must integrate these parameters into experimental models. Keywords: Thermal Interface Material; Thermal Paste; Carbon Nanotubes; Thermal Transfer Efficiency; Integrated Circuit; Heat Sink; Heat Dissipation.

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Section: Introductionmentioning

confidence: 99%

A Meta-study on the Thermal Properties of Carbon Nanotubes in Thermal Interface Materials

Clarkson¹,

Khan²,

Singh³

2019

PAMR

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“…Miniaturization and increased processing capabilities are the two technological trends of electronic devices, thus greater energy efficiency is desired whilst reducing their size. However, two major barriers to improve performance of such devices are the system interconnects and heat removal techniques [1]. System interconnect deals with integrating the front-side electronic device and the back-side cooling system, while heat dissipation techniques deal with enhancing heat transfer rates to the cooling system, or improving heat removal rates of the device [1].…”

Section: Introductionmentioning

confidence: 99%

“…However, two major barriers to improve performance of such devices are the system interconnects and heat removal techniques [1]. System interconnect deals with integrating the front-side electronic device and the back-side cooling system, while heat dissipation techniques deal with enhancing heat transfer rates to the cooling system, or improving heat removal rates of the device [1]. One solution to this is to integrate cooling into the electronic chips.…”

Section: Introductionmentioning

confidence: 99%

Ferrofluids for heat transfer enhancement under an external magnetic field

Gui

Stanley

Nguyen

et al. 2018

International Journal of Heat and Mass Transfer

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Overheating of power electronic devices has become a significant issue due to their continued miniaturization and increased heat flux that needs to be dissipated. Ferrofluids (magnetic nanofluids) have been shown to have higher thermal conductivity than their base aqueous or oil based fluids due to the solid magnetic nanoparticles that make up the ferrofluid. This allows higher convective heat transfer rates and, importantly, the ability to externally effect the flow using a magnetic field. In this paper, we focus on material characterization of ferrofluids and measurement of heat transfer rates for single-phase ferrofluidic forced convective flow in microchannels. We show that heat transfer properties of the flow are enhanced with the use of ferrofluids and that the material make-up of the ferrofluid affects these properties. In this paper, we argue that generally, convective heat transfer rates for ferrofluids are increased by increasing the solid volume concentration of magnetic particles (~0.2-0.4%). Interestingly, increasing magnetic flux was shown to decrease heat transfer enhancement. This was due to a reduction in the thermal conductivity of the bulk fluid caused by magnetic nanoparticles being drawn out of the isotropic mixture and becoming pinned to the channel wall in the region of strongest magnetic field. We show that there is good correlation between both theory and experimental visualization of this phenomenon.

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“…According to [8,27], single-phase micro-fluidic cooling can provide heat removal capacity as high as 700W/cm 2 and two-phase cooling is even more efficient [7]. Recently, researchers built a micro-channel cooling system in the Altera FPGA with 28nm technology node and achieved much lower chip temperature compared to the air cooling [18]. Despite of these benefits, MC Cooling comes with other overheads:…”

Section: Introductionmentioning

confidence: 99%

“…(1) TSVs cannot be built through micro-channels which results in a trade-off between micro-channel density and TSVbased vertical bandwidth; (2) extra energy is required to pump the coolant in order to cool the chip even though the pumping power is quite low according to the previous work [28,16,13]. For years, the application of micro-channel cooling in 3D ASICs has been widely studied [17,22] and a 2D FPGA with liquid-cooling was reported recently [18]. However, the design-time optimization of 3D FPGAs with micro-channel cooling has not been investigated.…”

Section: Introductionmentioning

confidence: 99%

Physical Design of 3D FPGAs Embedded with Micro-channel-based Fluidic Cooling

Yang

Srivastava

2016

Proceedings of the 2016 ACM/SIGDA International Symposium on Field-Programmable Gate Arrays

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Through Silicon Via (TSV) based 3D integration technology is a promising technology to increase the performance of FP-GAs by achieving shorter global wire-length and higher logic density. However, 3D FPGAs also suffer from severe thermal problems due to the increase in power density and thermal resistance. Moreover, past work has shown that leakage power can account for 40% of the total power at current technology nodes and leakage power increases non-linearly with temperature. This intensifies the thermal problem in 3D FPGAs and more aggressive cooling methods such as micro-channel based fluidic cooling are required to fully exploit their benefits. The interaction between micro-channel heat sink design and the performance of a 3D FPGA is very complicated and a comprehensive approach is required to identify the optimal design of 3D FPGAs subject to thermoelectrical constraints. In this work, we propose an analysis framework for 3D FPGAs embedded with micro-channelbased fluidic cooling to study the impact of channel density on cooling and performance. According to our simulation results, we provide guidelines for designing 3D FPGAs embedded with micro-channel cooling and identify the optimal design for each benchmark. Compared to naive 3D FPGA designs which use fixed thermal heat sink, the optimal design identified using our framework can improve the operating frequency and energy efficiency by up to 80.3% and 124.0%.

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Embedded cooling technologies for densely integrated electronic systems

Cited by 26 publications

References 8 publications

A Meta-study on the Thermal Properties of Carbon Nanotubes in Thermal Interface Materials

A Meta-study on the Thermal Properties of Carbon Nanotubes in Thermal Interface Materials

Ferrofluids for heat transfer enhancement under an external magnetic field

Physical Design of 3D FPGAs Embedded with Micro-channel-based Fluidic Cooling

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