Three-dimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking exacerbates an already difficult thermal problem. Localized hotspots within individual tiers can provide an additional challenge when the high heat flux region is buried within the stack. Numerous investigations have been launched in the previous decade seeking to develop cooling solutions that can be integrated within the 3D stack, allowing the cooling to scale with the number of tiers in the system. Two-phase cooling is of particular interest, because the associated reduced flow rates may allow reduction in pumping power, and the saturated temperature condition of the coolant may offer enhanced device temperature uniformity. This paper presents a review of the advances in two-phase forced cooling in the past decade, with a focus on the challenges of integrating the technology in high heat flux 3D systems. A holistic approach is applied, considering not only the thermal performance of standalone cooling strategies but also coolant selection, fluidic routing, packaging, and system reliability. Finally, a cohesive approach to thermal design of an evaporative cooling based heat sink developed by the authors is presented, taking into account all of the integration considerations discussed previously. The thermal design seeks to achieve the dissipation of very large (in excess of 500 W/cm2) background heat fluxes over a large 1 cm × 1 cm chip area, as well as extreme (in excess of 2 kW/cm2) hotspot heat fluxes over small 200 μm × 200 μm areas, employing a hybrid design strategy that combines a micropin–fin heat sink for background cooling as well as localized, ultrathin microgaps for hotspot cooling.

Understanding two-phase convective heat transfer under extreme conditions of high heat and mass fluxes and confined geometry is of fundamental interest and practical significance. In particular, next generation electronics are becoming thermally limited in performance, as integration levels increase due to the emergence of ‗hotspots' featuring up to ten-fold increase in local heat fluxes, resulting from non-uniform power distribution. An ultra-small clearance, 10 μm microgap, was investigated to gain insight into physics of high mass flux refrigerant R134a flow boiling, and to assess its utility as a practical solution for hotspot thermal management. Two configurations -a bare microgap, and inline micro-pin fin populated microgap -were tested in terms of their ability to dissipate heat fluxes approaching 1.5 kW/cm 2 . Extreme flow conditions were investigated, including mass fluxes up to 3,000 kg/m 2 s at inlet pressures up to 1.5MPa and 2 exit vapor qualities approaching unity. Dominant flow regimes were identified and correlated to two phase heat transfer coefficients obtained using model-based data reduction for both device configurations. The results obtained were compared to predictions using correlations from literature, with the maximum heat transfer coefficient reaching 1.5 MW/m 2 K in the vapor plume regime in the case of the finned microgap.

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