Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering

Lorenzini, Daniel; Green, Craig; Sarvey, Thomas E.; Zhang, Xuchen; Hu, Yuanchen; Fedorov, Andrei G.; Bakir, Muhannad S.; Joshi, Yogendra

doi:10.1016/j.ijheatmasstransfer.2016.08.040

Cited by 101 publications

(6 citation statements)

References 14 publications

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“…Energies 2024, 17, 127 2 of 11 gaps with variable pin fin densities [13], and hybrid jet-impingement/micro-channel heat sink [14,15], etc.…”

Section: Introductionmentioning

confidence: 99%

Multiphysics Simulation of a Novel Self-Adaptive Chip Cooling with a Temperature-Regulated Metal Pillar Array in Microfluidic Channels

Xiang,

Yang,

Zhang

et al. 2023

Energies

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Conventional liquid cooling techniques may provide effective chip cooling but at the expense of high pumping power consumption. Considering that there is dynamic heat load in practice, a self-adaptive cooling technique is desired to reduce operational costs while preserving inherent cooling effectiveness. In this work, a novel self-adaptive cooling strategy is presented to balance the thermal and flow efficiency in accordance with the dynamic thermal load, based on temperature-regulated movement of the metal pillar array in a microfluidic channel. With an illustrative device, the effectiveness of such a strategy is investigated using multiphysics modeling and simulation. As a case study, the device is considered to be initiated with a chip power of 5 W and an inlet coolant velocity of 0.3 m/s. It is shown that the temperature-regulated movement of the metal pillar heat sink will be activated rapidly and equilibrate within 30 s. Parts of the metal pillars immerse into the coolant flow, resulting in significantly improved heat transfer efficiency. The diminished thermal resistance leads to a reduction in chip temperature rise from 225 K (without structural adaptation) to 91.86 K (with structural adaption). Meanwhile, the immersion of metal pillars into the coolant also causes an increased flow resistance in the microfluidic channel (i.e., pressure drop increases from 859.27 Pa to 915.98 Pa). Nevertheless, the flow resistance decreases spontaneously when the working power of the chip decreases. Comprehensive simulation has demonstrated that the temperature-regulated structure works well under various conditions. Therefore, it is believed that the presented self-adaptive cooling strategy offers simple and cost-effective thermal management for modern electronics with dynamic heat fluxes.

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“…Energies 2024, 17, 127 2 of 11 gaps with variable pin fin densities [13], and hybrid jet-impingement/micro-channel heat sink [14,15], etc.…”

Section: Introductionmentioning

confidence: 99%

Multiphysics Simulation of a Novel Self-Adaptive Chip Cooling with a Temperature-Regulated Metal Pillar Array in Microfluidic Channels

Xiang,

Yang,

Zhang

et al. 2023

Energies

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“…High power dissipation in the core regions generates microhotspots locally. This calls for a shift from traditional microchannel designs with uniform flow to some novel ideas that enhance the heat transfer rates locally at the hot spots [24].…”

Section: Introductionmentioning

confidence: 99%

“…While passive cooling approaches including hotspot-targeted embedded liquid cooling or microgaps with variable pin fin clustering can help at localized hotspot mitigation [1,24], their effectiveness is limited due to some inherent disadvantages.…”

Section: Introductionmentioning

confidence: 99%

Alternating Current Electrothermal Flow for Energy Efficient Thermal Management of Microprocessor Hot Spots

Kunti

Dhar

Bhattacharya

et al. 2019

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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The paper presents numerical results on an innovative concept of an efficient, site-specific cooling technology for microprocessor hot spots using Alternating Current Electrothermal Flow (ACET). ACET deploys an electrokinetic transport mechanism without requiring any external prime mover and can be shown to be highly effective in reducing hot spot temperatures below their allowable limits. The proposed technique leverages the heat source(s) itself to drive the fluid in the ACET cooling mechanism, thereby making this a highly energy efficient active technique. Our parametric analyses present the optimal range of fluid properties, viz. electrical conductivity where the cooling efficiency is maximum.Further, the impact of geometrical parameters as well as input voltages has been characterized. Our results show a reduction of hot spot temperature by more than 30% for flow through a channel of 600 microns under appropriate conditions at an applied AC voltage of 10-12 V. Comparison with other micro-cooler technologies show the proposed technique to be more energy efficient in its range of operation. These results establish the potential of the ACET cooling and can open up a new avenue to be explored for thermal management of miniaturized devices and systems.

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“…There are many more reports regarding microfluidic cooling, however, most of them used microchannel flow in which coolant does not contact with hotspot directly and become less efficient. To tackle the low efficiency, near junction hotspot cooling methods using thermoelectric [17][18][19] and using microfluidic on-demand coolant delivery [20][21][22][23][24] were introduced. However, thermoelectric cooling efficiency is highly limited by materials.…”

Section: Introductionmentioning

confidence: 99%

Demonstration of hotspot cooling using digital microfluidic device

Bindiganavale¹,

Amaya

Moon

2018

J. Micromech. Microeng.

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To respond to the dire need of smaller but more effective ways to handle non-uniform temperature distribution (a.k.a. hotspots) within an electronic device, this paper presents the concept of droplet-based cooling and its proof-of-concept demonstration. An electrowetting-on-dielectric (EWOD) digital microfluidic device with parallel plates configuration was used to control coolant droplet motion. Periodic rise and falls in hotspot temperature were measured when multiple water droplets moved over the hotspot surface while a constant heat flux was applied at the hotspot. Synchronized high-speed video data of droplet motion shows that phase-change heat transfer (i.e. evaporation) at the water droplet meniscus coincided with additional temperature drop at the hotspot. Furthermore, the heat transfer coefficient of water droplet evaporation was measured on a hydrophilic hotspot surface. The hydrophilic surface regulated the hotspot temperature within a lower envelope for a longer time.

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Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering

Cited by 101 publications

References 14 publications

Multiphysics Simulation of a Novel Self-Adaptive Chip Cooling with a Temperature-Regulated Metal Pillar Array in Microfluidic Channels

Multiphysics Simulation of a Novel Self-Adaptive Chip Cooling with a Temperature-Regulated Metal Pillar Array in Microfluidic Channels

Alternating Current Electrothermal Flow for Energy Efficient Thermal Management of Microprocessor Hot Spots

Demonstration of hotspot cooling using digital microfluidic device

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