2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits) 2016
DOI: 10.1109/vlsic.2016.7573504
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Embedded memory and ARM Cortex-M0 core using 60-nm C-axis aligned crystalline indium-gallium-zinc oxide FET integrated with 65-nm Si CMOS

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Cited by 29 publications
(22 citation statements)
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“… DOSRAM module with stacked Si and OSFET s: (A) cross section, (B) chip micrograph, and (C) circuit diagram of memory cell…”
Section: Osfet Memory Characteristicsmentioning
confidence: 99%
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“… DOSRAM module with stacked Si and OSFET s: (A) cross section, (B) chip micrograph, and (C) circuit diagram of memory cell…”
Section: Osfet Memory Characteristicsmentioning
confidence: 99%
“…The prototype is a CPU‐embedded 8‐kB DOSRAM . The DOSRAM has an operating frequency of 30 MHz that is applied to CPU, and its data retention time is more than 1 hour.…”
Section: Osfet Memory Characteristicsmentioning
confidence: 99%
See 1 more Smart Citation
“…In recent years, high-performance a-IGZO TFTs are expected to be important for applications to the future microelectronics [1,2,3], because of their high mobility, low processing temperature, and large area uniformity [4,5]. Compare to conventional staggered bottom-gate structure, self-aligned top-gate structure has a low parasitic capacitance which leads to a smaller signal delay and increases the operating speed of circuits [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…Examples of OS LSI in which nonvolatile memory elements are built with OS-FETs exhibiting ultralow off-state current include normally-off (N-off) processors [9][10][11], nonvolatile FPGAs (OS FPGA) [12][13][14][15][16], nonvolatile oxide semiconductor random access memory (NOSRAM) [17,18], dynamic oxide semiconductor random access memory (DOSRAM) [19], a global-shutter image sensor [20], and a vision sensor [21]. The possibility of device scaling has been verified [22], and prototyping of OS LSI using a foundry's 65-nm Si process has been reported previously [23,24].…”
Section: Introductionmentioning
confidence: 99%