Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies 2019
DOI: 10.1002/9781119313991.ch23
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Embedded Multi‐die Interconnect Bridge (EMIB)

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Cited by 8 publications
(1 citation statement)
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“…These trends in FPGA architecture along with with recent advances in 2.5D and 3D chip integration technologies [3], [21] have resulted in the emergence of a new class of beyond-FPGA reconfigurable devices that combine the flexibility of FPGAs, the efficiency of hard NoCs for data steering, and the high-performance of specialized accelerator blocks. Our work focuses on building tools that enable rapid architecture exploration for these complex devices and also facilitate application re-design when migrating from conventional FP-GAs to novel RADs.…”
Section: Background and Related Work A The Emergence Of Beyond-fpga Radsmentioning
confidence: 99%
“…These trends in FPGA architecture along with with recent advances in 2.5D and 3D chip integration technologies [3], [21] have resulted in the emergence of a new class of beyond-FPGA reconfigurable devices that combine the flexibility of FPGAs, the efficiency of hard NoCs for data steering, and the high-performance of specialized accelerator blocks. Our work focuses on building tools that enable rapid architecture exploration for these complex devices and also facilitate application re-design when migrating from conventional FP-GAs to novel RADs.…”
Section: Background and Related Work A The Emergence Of Beyond-fpga Radsmentioning
confidence: 99%