Large-body-sized Glass-based Active Interposer for High-Performance Computing

Ravichandran, Siddharth; Kathaperumal, Mohanalingam; Swaminathan, Madhavan; Tummala, Rao

doi:10.1109/ectc32862.2020.00144

Cited by 19 publications

(3 citation statements)

References 21 publications

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“…By contrast, current silicon interposers and mold compound embedded packages are not able to compete in terms of I/O pitch, bandwidth, and reliably owing to thermo-compression bonding assembly and die shift induced limits [19]. More recently, several 3D glassbased package architectures for HPC applications have been demonstrated in [80], [81], [82]. The advanced 3D package concept as illustrated in Fig.…”

Section: Packaging and Interposer Solutionsmentioning

confidence: 99%

“…7(f)) which land from the thin build-up layers directly onto the chip pads [85], [86], [19], [81], [88]. Via-in-via through package interconnects [26], [80], [81] and microviaenhanced organic RDLs on glass core substrates [114], [115], [116] were also reported for future HPC and wireless communications systems.…”

Section: Components a Transmssion Lines And Interconnectsmentioning

confidence: 99%

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RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).

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Section: Packaging and Interposer Solutionsmentioning

confidence: 99%

Section: Components a Transmssion Lines And Interconnectsmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

View full text Add to dashboard Cite

show abstract

“…The ring- and cavity-type heat spreaders are designed to improve the warpage behavior of the concerned vehicle by the high stiffness of the heat spreader. A design concept of glass panel embedding technology was proposed; it embeds the concerned chip in the glass substrates with plated RDL and TGV to achieve a trace below 2 μm by adopting polymer RDL, providing a solution for warpage control [ 38 ]. Cu bridge design improves upon conformal Cu-filled via structures and has superior reliability against thermal stress [ 39 ].…”

Section: Introductionmentioning

confidence: 99%

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

et al. 2023

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The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and deactivation technique in finite element analysis architecture. The submodeling technique is also utilized to mostly conquer the scale mismatch and difficulty in mesh gridding design. It is also used to analyze the thermomechanical responses of glass interposers with chiplet arrangements and capped epoxy molding compounds (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters for stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of the glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling.

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3D IC Integration and 3D IC Packaging

Lau

2021

Semiconductor Advanced Packaging

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Large-body-sized Glass-based Active Interposer for High-Performance Computing

Cited by 19 publications

References 21 publications

RF Glass Technology Is Going Mainstream: Review and Future Applications

RF Glass Technology Is Going Mainstream: Review and Future Applications

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

3D IC Integration and 3D IC Packaging

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