Embedded planar power inductor technology for package-level DC power grid

Kondo, Y.; Yazaki, Yoshihiko; Sonehara, Makoto; Sato, Toshiro; Watanabe, Toshiya; Seino, Yuto; Matsushita, Nobuhiro; Fujii, Tomoharu; Kobayashi, K.; Shimizu, Hiroshi; Yanagisawa, Yuki; Someya, T.; Fuketa, Hiroshi; Takamiya, Makoto; Sakurai, Takayasu

doi:10.1109/icep-iaac.2015.7111123

Cited by 7 publications

(3 citation statements)

References 5 publications

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“…3d. However, so far the research has mainly focused on the low-power (1-100 W) range [42], [43], which is especially suited to the "Point Of Load" (POL) converters used, for example, in the power management of computers.…”

Section: B Embedding Of Formed Componentsmentioning

confidence: 99%

Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development

Buttay

Martin

Morel

et al. 2018

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3d-Peim)

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HAL is a multidisciplinary open access archive for the deposit and dissemination of scientific research documents, whether they are published or not. The documents may come from teaching and research institutions in France or abroad, or from public or private research centers. L'archive ouverte pluridisciplinaire HAL, est destinée au dépôt et à la diffusion de documents scientifiques de niveau recherche, publiés ou non, émanant des établissements d'enseignement et de recherche français ou étrangers, des laboratoires publics ou privés.

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Section: B Embedding Of Formed Componentsmentioning

confidence: 99%

Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development

Buttay

Martin

Morel

et al. 2018

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3d-Peim)

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“…However, the fabrication of these inductors is complex and costly, posing challenges in terms of manufacturability and scalability. Most of the recent work undertaken for high current density planar inductors has focused on: 1) directly mounting bulk ferrite cores on PCB with carefully trace winding design [9,10]; 2) deposing spin-sprayed [11], laminated [12], or stencil printed [13] magnetic composites on the interposer; 3) integrating low temperature co-fired ceramic (LTCC) ferrite with PCB active layers [14][15][16][17]; and 4) implanting thin film magnetic materials into the PCB via wire bonding [18,19] or flip chip [20].…”

Section: Introductionmentioning

confidence: 99%

Adjustable High Current Low Profile Sandwich Inductor Using Nanocrystalline Flake Ribbon Core

Li,

Shillaber

et al. 2024

IEEE Open J. Power Electron.

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Compact and high current inductors determine the power density and efficiency of voltage regulators (VRs) for computing ICs. Conventional moulding structures using powder cores and gapped ferrite cores are reaching the limits of size miniaturisation. In this paper, a sandwich-structured inductor using 2D magnetic nanocrystalline flake ribbon (NFR) is developed to achieve high current density and low height. The analytical models of inductance and conduction losses are developed and validated by finite element methods and experiments. A 5 to 1 V, 50A, VR is built to compare the performance of the fabricated NFR sandwich inductor to the latest commercial counterpart. Thermal performance is investigated, stability tests under solder iron heat and reflow temperature are performed. The fabricated sandwich inductor is featured as simple structure, low profile, low DC resistance (DCR), high saturation current, soldering heat stable, but in the modest compromise of the AC conduction and core losses.T

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“…Among the passive components, magnetic components are attractive candidates for embedding technologies because they are generally custom components. Planar components (with winding formed on a PCB and low-profile, E-shape magnetic cores clamped around) partially address these issues but fully PCB embedded structures can go further as described in [3], but so far, most of the research is focused on low-power (1-100 W) components [4], [5]. [6] shows that little improvements are to be expected from the magnetic materials in the foreseeable future.…”

Section: Introductionmentioning

confidence: 99%

Design, manufacturing and characterization of printed circuit board embedded inductors for power applications

Buttay

Mrad

Lesle

et al. 2018

2018 IEEE International Conference on Industrial Technology (ICIT)

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The Printed-Circuit-Board (PCB) technology is attractive for power electronic systems as it offers a low manufacturing cost for mass production. Power inductors are large and complex to manufacture, because they usually are custom components which must be wound individually. Inductors based on PCB technology can reduce the complexity and cost while using a wasted space (the thickness of said PCB). In this paper, a procedure to design such inductors is summarized, with a focus on inductors intended to be implemented in converters in the 100-1000 W range. The main contribution of this paper is the description of the manufacturing process : the inductors use PCB to host their magnetic core while their winding is made by patterning the PCB copper layers and using copper vias. In addition, new experimental results are presented : the prototypes are electrically characterized, and the results are discussed to present the advantages and drawbacks of this technology, as well as the remaining open questions.

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Embedded planar power inductor technology for package-level DC power grid

Cited by 7 publications

References 5 publications

Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development

Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development

Adjustable High Current Low Profile Sandwich Inductor Using Nanocrystalline Flake Ribbon Core

Design, manufacturing and characterization of printed circuit board embedded inductors for power applications

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