2007
DOI: 10.1109/temc.2006.888181
|View full text |Cite
|
Sign up to set email alerts
|

EMC Assessment at Chip and PCB Level: Use of the ICEM Model for Jitter Analysis in an Integrated PLL

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

0
13
0

Year Published

2008
2008
2015
2015

Publication Types

Select...
4
3

Relationship

0
7

Authors

Journals

citations
Cited by 36 publications
(14 citation statements)
references
References 1 publication
0
13
0
Order By: Relevance
“…The model can be used for emission simulations due to IC internal activities, within the frequency range of 150 kHz to 1 GHz [2]. It allows IC manufacturers and system integrators to analyze, optimize, and predict several parameters such as auto compatibility of mixedsignal ICs, radiated and conducted emissions of an IC, radiated emission of a global system, decoupling capacitors on a printed circuit board (PCB) and the number of power-supply pin pairs [13] [14]. The purpose of this standard model is to provide data to enable PCB EM tools to compute the EM fields produced by ICs and their associated PCB.…”
Section: Icemmentioning
confidence: 99%
See 1 more Smart Citation
“…The model can be used for emission simulations due to IC internal activities, within the frequency range of 150 kHz to 1 GHz [2]. It allows IC manufacturers and system integrators to analyze, optimize, and predict several parameters such as auto compatibility of mixedsignal ICs, radiated and conducted emissions of an IC, radiated emission of a global system, decoupling capacitors on a printed circuit board (PCB) and the number of power-supply pin pairs [13] [14]. The purpose of this standard model is to provide data to enable PCB EM tools to compute the EM fields produced by ICs and their associated PCB.…”
Section: Icemmentioning
confidence: 99%
“…By doing so, the IC can be simulated on a basic analog simulator such as SPICE, allowing the design engineer to evaluate the noise values in an early stage of the design process [14].…”
Section: Icemmentioning
confidence: 99%
“…Such approaches have been demonstrated in literature in order to conceive emission models, e.g. [19]. .…”
Section: Improved Test Board Design and Analysis By Means Of Em/circumentioning
confidence: 99%
“…One method for better understanding the impact of ICs on EMC is through models of the power delivery network like the ICEM or LECCS specifications [1,2]. Previous research has shown the promise of these models in several scenarios, including prediction of the conducted emissions from ICs [3,4], of clock jitter [3], of the influence of decoupling capacitors on conducted emissions [3][4][5], and of substrate noise in mixed-signal designs [6].…”
Section: Introductionmentioning
confidence: 99%
“…Models of the IC may be obtained either through measurement or by using IC development tools that can extract resistive, capacitive and inductive values associated with the IC core and package, as well as the time-domain current consumed by the core [3][4][5][6][7]. Models of the PCB are typically found through measurement or are only predicted at low frequencies, though methods of predicting the high-frequency impedance characteristics of PCBs are available [8].…”
Section: Introductionmentioning
confidence: 99%