2008 Design, Automation and Test in Europe 2008
DOI: 10.1109/date.2008.4484862
|View full text |Cite
|
Sign up to set email alerts
|

Emerging Yield and Reliability Challenges in Nanometer CMOS Technologies

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
20
0
3

Year Published

2009
2009
2022
2022

Publication Types

Select...
4
3
1

Relationship

0
8

Authors

Journals

citations
Cited by 60 publications
(23 citation statements)
references
References 32 publications
0
20
0
3
Order By: Relevance
“…In cases such as this, the relay could not be turned off, even after V G is lowered back to zero. As illustrated in 6 (b), the channel potential is also at VDD resulting in electrostatic force between the channel and the body (8). A large overlap area between the channel and the body (A CB ), creates electrostatic force large enough to overpower the spring restoring force (V RL drops to below 0V).…”
Section: Parasitic Channel Actuationmentioning
confidence: 99%
“…In cases such as this, the relay could not be turned off, even after V G is lowered back to zero. As illustrated in 6 (b), the channel potential is also at VDD resulting in electrostatic force between the channel and the body (8). A large overlap area between the channel and the body (A CB ), creates electrostatic force large enough to overpower the spring restoring force (V RL drops to below 0V).…”
Section: Parasitic Channel Actuationmentioning
confidence: 99%
“…The reduction of supply voltage leads to a direct loss of headroom when designing analogue circuitswhich in turn impacts on dynamic range, noise and signal integrity. As technologies become smaller, leakage becomes a greater problem in analogue circuits, indeed this is one of the most significant problems for digital design [4]. Variability in process parameters is a far greater problem in DSM nodes especially as device models are reaching their limits of predictability [5].…”
Section: Introductionmentioning
confidence: 99%
“…In the case of analogue circuits the impact of variability can be complex due to a large number of performance specifications. Traditional approaches to increase robustness and resilience can introduce unacceptable power and area penalties when applied to modern process nodes [4]. Conventional techniques have attempted to mitigate the effects of device variability using a standard robust design approach, but this clearly has limitations, and does not fundamentally address the issue of post-manufacture failure, lifetime degradation and device drift [8], [9], [10].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…As semiconductor technology continuously scales, the joint effects of manufacture process variations and operational lifetime parameter degradations have been a major concern for analog circuit designers since they affect the lifetime yield value, i.e., the percentage of the products which can satisfy all of the pre-defined specifications during lifetime operation (Alam, Kang, Paul & Roy, 2007), (Gielen et al, 2008). The analysis and optimization of analog circuits considering process variations alone have been in research for decades, and certain design centering algorithms and commercial software are available to achieve a design for yield (more specifically, fresh yield) (Nassif, 2008), (Antreich et al, 1994).…”
Section: Introductionmentioning
confidence: 99%