Emissive Metallacage‐Cored Polyurethanes with Self‐Healing and Shape Memory Properties

Abstract

The structures of the crosslinks in supramolecular polymer networks play an important role on their properties and functions. Herein, emissive metallacages are used as crosslinks to prepare metallacage-cored polyurethanes. The mechanical properties including storage modulus, toughness, Young's modulus and breaking strength of polymers are greatly enhanced with the increase of crosslinking densities. Moreover, such polymers not only exhibit good fluorescence in the solid state, but also show self-healing and shape memory properties owing to the dynamic reversible non-covalent bonds in their structures. This study not only offers a convenient strategy to prepare metallacage-crosslinked networks, but also explores their applications as selfhealing and shape memory materials, which will promote the study of metallacage-cored supramolecular networks as smart materials.

Hexaphenyltriphenylene‐Based Multicomponent Metallacages: Host–Guest Complexation for White‐Light Emission

“…These data were in good agreement with their calculated values. All the above results are consistent with previous reports, [43–48] suggesting the formation of relevant discrete multicomponent metallacages.…”

Mechanically Ductile, Self-Healable, Low-Temperature, and Water-Tolerant Polyurethane for High-Performance Strain Sensor

“…Under thermal driving, the hydrogen bonds gradually dissociated, the movement of the PU molecular chains was accelerated, and the molecular chains on either side of the scratch underwent chain migration and diffusion. Subsequently, dynamic reversible disulfide bonds approached each other and underwent reversible exchange behavior, thus enabling the reconnection of molecular chains and the repair of the PU elastomers. ,, …”

“…Subsequently, dynamic reversible disulfide bonds approached each other and underwent reversible exchange behavior, thus enabling the reconnection of molecular chains and the repair of the PU elastomers. 21,60,61 To demonstrate the application of PU in flexible electronic devices, we prepared a strain sensor using PU 1%BADS as the substrate and CNTs as the conductive filler through a simple ultrasonic mixing and drying process. Initially, the CNTs wrapped tightly around each other and the flexible sensor formed a conductive pathway with a low resistance.…”

Shape memory photonic materials: fabrication and emerging applications

“…Among them, direct thermal triggering is the most conventional and straightforward method for SMPs due to its simple operation process and excellent shape memory recovery effects, and it has been investigated extensively. 44 A series of smart polymers have been used to develop thermally-triggered SMPs, such as polyurethane (PU), 51 polyimide, 52 polystyrene, 53 polyacrylate (PAA), 54 polysulfone, 55 poly(lactide), 56 poly(caprolactone), 57 This journal is © The Royal Society of Chemistry 2023 and epoxy resin. 58 However, the low thermal conductivity of the polymer limits the response rate of SMPs to temperature.…”