2006
DOI: 10.1016/j.jcrysgro.2005.10.078
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Emissivity-correcting near-UV pyrometry for group-III nitride OMVPE

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Cited by 18 publications
(18 citation statements)
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“…Briefly, the system uses one 2 00 wafer centered on the rotation axis, with temperature and reflectance measured near the center of the wafer. Absolute wafer temperature is measured using a near-ultraviolet (NUV) emissivity-correcting pyrometer (ECP) we developed [22]. The GaN MOVPE conditions are given in Ref.…”
Section: Methodsmentioning
confidence: 99%
“…Briefly, the system uses one 2 00 wafer centered on the rotation axis, with temperature and reflectance measured near the center of the wafer. Absolute wafer temperature is measured using a near-ultraviolet (NUV) emissivity-correcting pyrometer (ECP) we developed [22]. The GaN MOVPE conditions are given in Ref.…”
Section: Methodsmentioning
confidence: 99%
“…Under these conditions measurement of the thermal emission signal and sample reflectance (or emissivity) must be done to a higher level of accuracy (as compared with short wavelength pyrometers). For example, given a 1% error in thermal emission signal at 750 1C the NUV pyrometer [28] yields a 0.3 1C error, while the MIR pyrometer yields a 10 1C error (factor of 30 worse).…”
Section: Design Of the Mir Pyrometermentioning
confidence: 99%
“…We were fortunately able to use most of the data acquisition software and wafer indexing and synchronization hardware we developed for the NUV-ECP system [28], with only minor modifications. With the wafer carrier spinning at 500-1200 rpm we are able to measure and keep track of the MIR temperature and reflectance (as well as the 550 nm reflectance) of each of the three 2 00 sapphire wafers.…”
Section: Design Of the Mir Pyrometermentioning
confidence: 99%
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