Employing Weibull Analysis and Weakest Link Theory to Resolve Crystalline Silicon PV Cell Strength Between Bare Cells and Reduced- and Full-Sized Modules

Bosco, Nick; Springer, Martin; Liu, Jiqi; Venkat, Sameera Nalin; French, Roger H.

doi:10.1109/jphotov.2021.3056673

Cited by 8 publications

(5 citation statements)

References 11 publications

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“…For the same module loading condition, cells within larger modules are more likely to fracture [38]. Thus, larger modules are potentially susceptible to more frequent cell breakage due to weather, shipping, handling, or installation.…”

Section: A Larger Modulesmentioning

confidence: 99%

“…Using larger wafers may increase the risk of damage during the handling, manufacturing, and packaging of large-format modules. Larger wafers are more susceptible to cracking than smaller wafers [38]. However, the most important reliability considerations relate to cell-cutting processes and the resulting cut-cell dimensions, which are discussed as follows.…”

Section: B Larger Cellsmentioning

confidence: 99%

“…From a reliability perspective, the smaller cells resulting from cutting are less susceptible to cracking than larger cells [38]. However, the cutting process introduces the potential for cell cracking due to defects along the cut edges [51], [52], [53].…”

Section: Cell Cuttingmentioning

confidence: 99%

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Getting Ahead of the Curve: Assessment of New Photovoltaic Module Reliability Risks Associated With Projected Technological Changes

Zuboy,

Springer,

Palmiotti

et al. 2024

IEEE J. Photovoltaics

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Maintaining the reliability of photovoltaic (PV) modules in the face of rapidly changing technology is critical to maximizing solar energy's contribution to global decarbonization. Our review describes expected changes in PV technology and their impacts on performance and reliability. We leverage PV market reports, interviews with PV researchers and other industry stakeholders, and peer-reviewed literature to narrow the multitude of possible changes into a manageable set of 11 impactful trends likely to be incorporated in near-term crystalline-silicon module designs. We group the trends into four categories (module architecture, interconnect technologies, bifacial modules, and cell technology) and explore the drivers behind the changes, their interactions, and associated reliability risks and benefits. Our analysis identifies specific areas that would benefit from accelerating the PV reliability learning cycle to assess emerging module products and designs more accurately. We recommend that researchers continue tracking module technologies and their reliability implications, so efforts can be focused on the most impactful trends. As the rapid technological turnover continues, it is also critical to incorporate fundamental knowledge into models that can predict module reliability. Predictive capabilities complete the PV reliability learning cycle-reducing the time required to assess new designs and mitigating the risks associated with large-scale deployment of new products.

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Section: A Larger Modulesmentioning

confidence: 99%

Section: B Larger Cellsmentioning

confidence: 99%

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Getting Ahead of the Curve: Assessment of New Photovoltaic Module Reliability Risks Associated With Projected Technological Changes

Zuboy,

Springer,

Palmiotti

et al. 2024

IEEE J. Photovoltaics

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“…That is, the observed V th is considered to coincide with the smallest V th among the k OTS paths. In other words, the weakest link model [30][31][32][33] scaled by the area ratio k holds.…”

Section: Size Dependencementioning

confidence: 99%

Statistical modeling of V _th distribution in ovonic threshold switches based on physical switching models

Yokogawa¹

2023

Jpn. J. Appl. Phys.

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This paper discusses the statistical modeling of the Vth distribution of the ovonic threshold switch, a key component of high-speed, high-capacity storage-class memory. Based on three representative switching mechanisms—thermal runaway model, physically based electrical model, and two-state defect model—we propose a distribution function that explains Vth variation and a method for estimating and judging it. Through Monte Carlo simulations and analytical analysis of the distribution function, we examined the relationship between the segment Vth distribution and the Vth minimum distribution considering the chip-level scaling. The latter distribution approaches the Weibull distribution, but its convergence speed differs.

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“…Since all relevant scales cannot be resolved within the same model without incurring extreme computational cost, analyzing detailed stress profiles within the module requires propagation of a module scale load such as wind or snow pressure to a subscale model of the subcomponent of interest. This can be done by operating separate models for each scale, whereby the full module scale model contains a simplified representation of cells without metallization details, 5,6 and domain transfers are utilized to propagate boundary conditions to the sub-scale model containing details of interest such as interconnections and their effects on cells. 7,8 Since the propagated boundary is typically a simple equation-driven curvature or surface profile, 7 and the module itself is a geometrically regular structure, some potential for reducing computational expense at the module scale appears possible.…”

Section: Introductionmentioning

confidence: 99%

Analyzing photovoltaic module mechanics using composite plate theories and finite element solutions

Hartley

Khraishi

2023

Journal of Composite Materials

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Deflection and stress calculated from an experimentally validated, high-fidelity finite element model (FEM) of a photovoltaic module experiencing mechanical load was compared to results from a simplified FEM treating the module laminate as a homogenized composite using a rule of mixtures approach, and further compared to analytical calculations treating the module as a Kirchoff-Love flat plate. The goal of this study was to determine the error incurred by analyzing module mechanics with varying levels of simplification, since resolving the aspect ratios of a module is computationally expensive. Homogenized FEMs were found to underpredict peak deflection under a 1.0 kPa load by between 13 and 19% for lower and upper bound application of the rule of mixtures. However, module shape was captured, implying that a useful replication of a resolved model could be achieved with a reduced, calibrated material stiffness. Homogenized stress results captured glass layer tensile stress components to within 46 to 52% at a sample location of interest, though agreement was poor through the remainder of the laminate due to the lack of material resolution. For plate theory, deflection was overpredicted by 45 to 67% for upper and lower bound homogenizations, and frame-adjacent module shapes were not adequately replicated. Stress results mirrored FEM trends but magnitudes were not well correlated to resolved model values. These results support the use of homogenized laminate models for module shape derivation, though resolved models remain necessary for stress analyses. The accuracy of plate theory was found to be inadequate for most applications.

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Employing Weibull Analysis and Weakest Link Theory to Resolve Crystalline Silicon PV Cell Strength Between Bare Cells and Reduced- and Full-Sized Modules

Cited by 8 publications

References 11 publications

Getting Ahead of the Curve: Assessment of New Photovoltaic Module Reliability Risks Associated With Projected Technological Changes

Getting Ahead of the Curve: Assessment of New Photovoltaic Module Reliability Risks Associated With Projected Technological Changes

Statistical modeling of V _th distribution in ovonic threshold switches based on physical switching models

Analyzing photovoltaic module mechanics using composite plate theories and finite element solutions

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Employing Weibull Analysis and Weakest Link Theory to Resolve Crystalline Silicon PV Cell Strength Between Bare Cells and Reduced- and Full-Sized Modules

Cited by 8 publications

References 11 publications

Getting Ahead of the Curve: Assessment of New Photovoltaic Module Reliability Risks Associated With Projected Technological Changes

Getting Ahead of the Curve: Assessment of New Photovoltaic Module Reliability Risks Associated With Projected Technological Changes

Statistical modeling of V th distribution in ovonic threshold switches based on physical switching models

Analyzing photovoltaic module mechanics using composite plate theories and finite element solutions

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Product

Resources

About

Statistical modeling of V _th distribution in ovonic threshold switches based on physical switching models