Enabling laser applications in microelectronics manufacturing

Delmdahl, Ralph; Brune, J.; Fechner, Burkhard; Senczuk, Rolf

doi:10.1007/s00339-016-9665-y

Cited by 2 publications

(1 citation statement)

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“…Two optical processing strategies are fundamentally applied, which are scanning the substrate using a wide line beam (line‐scan method) and rectangular laser spot (step‐and‐repeat method), as shown schematically in Figure c. The laser beam is shaped by a telescope which converts the original laser beam profile into line‐shaped beam profile.…”

Section: Laser Lift‐off Processmentioning

confidence: 99%

Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

Bian

Zhou

Wan

et al. 2019

Adv Elect Materials

112

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materials and enable innovative applications that are hard to achieve with current microelectronics. Examples vary from biointegrated devices for clinical diagnosis and treatment, [11][12][13] to electronic skin (E-Skin), [14][15][16] energy harvesting/storage devices, [17][18][19][20][21] and sweat sensor, [22,23] to flexible display, [24,25] and to RFID tags, [26,27] etc.Two main kinds of microfabrication processes have been developed for flexible electronics, including the solutionprocessable methods and vacuum-based methods (lithographic patterning and undercut etching). [28] The former is naturally compatible with flexible substrates and can deposit and pattern functional materials in one single step. [29][30][31] They have fabricated various printed electronics with increasing performance, such as conductive metal wires, [32][33][34] thin film transistors (TFTs), [35][36][37] and piezoelectric devices. [38][39][40][41] However, the electronic performance is still limited by the properties of solution-processable functional materials and low resolution of printing techniques, with respect to standard microfabrication process. [42] On the other side, vacuum-based microfabrication techniques provide wellestablished routes to realize high-performance electronics, but generally incompatible with large-area, flexible (polymeric substrates). Ideally, high performance flexible electronics systems are usually fabricated by built-up process that begins with independent fabrication of high-modulus, fragile, chip-scale elements (e.g., IC chips, MEMS, sensors, and power sources) or flexible devices (e.g., flexible sensor, flexible display, and TFT array) on donor wafers, followed by being transferred onto flexible/stretchable substrates.The above manufacturing routes of flexible electronics can be concluded as the transfer of the materials, components, and devices from original fabricated/prepared substrates to flexible ones. The most significant built-in challenge in transferring is to control of interface status to accommodate to the disparate nature of the transferred objects from donor wafer/substrate. Distinctive assembly techniques based on stress-induced interface fracture have been invented to be adaptive to the diversity of material properties and geometric sizes that lead to tremendous differences in mechanical properties. For those conventional rigid electronic components like IC chips, they are transferred by standard single-ejector needle pick-and-place It is challenging to manufacture large-area, ultrathin, flexible/stretchable electronics on an industrial scale. Recent ground-breaking advances in the manufacture of flexible electronics are based on powerful laser processes. Laser irradiation at an internally absorbing interface through a transparent substrate will bring various physical changes and chemical reactions at the interface, accompanied by distinct phenomena. Numerous techniques derived from these phenomena with the unique ability to fabricate materials, structures, and devices on flexible subst...

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Section: Laser Lift‐off Processmentioning

confidence: 99%