Enabling Rapid Production and Mass Customisation of Electronics Using Digitally Driven Hybrid Additive Manufacturing Techniques

Abstract

Abstract-Additive Manufacturing processes can facilitate the rapid iterative product development of electronic devices by optimising their design and functionality. In addition, these methods present a number of potential advantages for improving the production speed and complexity of mass customised and bespoke electronics. In this paper, we present a new digitally driven hybrid fabrication process chain, capable of producing functional, multilayer electronics embedded within geometrically complex 3D printed structures. This has been achieved by interleaving stereolithography, micro-dispensing and surface mount assembly. The resultant combination of different template-less manufacturing techniques enables both the formation of multi-material circuits (conductors and dielectrics) and where the package housing encapsulates the electronics and forms part of the final 3D device. This paper also details the developments around depositing novel freestanding z-axis interconnects. A 555 timer circuit with flashing LED manufactured within a 3D pyramid was used as a demonstrator. The demonstrator contained circuits with feature sizes down to 170 m, and packaged components of 0603 size, a Small Outline Integrated Circuit (SOIC) and a SMD LED. In addition, flip chip packaging on 3D printed substrates has been demonstrated.

Selectively Metalizable Low-Temperature Cofired Ceramic for Three-Dimensional Electronics via Hybrid Additive Manufacturing

“…Our previous work also presented two “selective metallization” HAM technologies. One built a 3D structure with platable and inplateble plastics via dual-material FDM printing, and then electrolessly plated the metallic circuitry on platable plastic. , The other developed a new type of functional photocurable resin that could be SLA printed, selectively laser-activated, and electrolessly plated to create both DC and high-frequency electronic devices …”

“…One built a 3D structure with platable and inplateble plastics via dual-material FDM printing, and then electrolessly plated the metallic circuitry on platable plastic. 27,28 The other developed a new type of functional photocurable resin that could be SLA printed, selectively laseractivated, and electrolessly plated to create both DC and highfrequency electronic devices. 29 However, all of the HAM works mentioned above are focused on a polymer matrix, which is normally vulnerable in harsh working environments and unable to endure high temperature, high voltage, and high mechanical stress.…”

Design Methodology to Improve Human-Robot Coproduction in Small- and Medium-Sized Enterprises

“…personalize/customize/produce products in an on-demand fashion. This holds true for personal as well as industrial products [1], [2]. The driving force behind this has been the achievements in intelligent manufacturing systems (IMS) [3].…”