2015
DOI: 10.1016/j.simpat.2015.04.008
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Energy and thermal models for simulation of workload and resource management in computing systems

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Cited by 25 publications
(6 citation statements)
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“…Inlet temperature (Tin) oscillates between 19.5 • C and 21.5 • C. One should note that the inlet temperature for the nodes located closer to the outlet is equal to the temperature of air leaving the preceding node (outlet temperature calculated considering the preceding nodes). Based on our observations [13], we noticed that a good approximation of local ambient temperature (T amb ) is a weighted average of inlet and processor temperature, expressed as follows: T amb = (Tcpu + 2 * Tin)/3.…”
Section: Methodsmentioning
confidence: 95%
See 1 more Smart Citation
“…Inlet temperature (Tin) oscillates between 19.5 • C and 21.5 • C. One should note that the inlet temperature for the nodes located closer to the outlet is equal to the temperature of air leaving the preceding node (outlet temperature calculated considering the preceding nodes). Based on our observations [13], we noticed that a good approximation of local ambient temperature (T amb ) is a weighted average of inlet and processor temperature, expressed as follows: T amb = (Tcpu + 2 * Tin)/3.…”
Section: Methodsmentioning
confidence: 95%
“…In terms of thermal models we follow the ones presented in our recent studies [13]. Hence, the changes in temperature of the processor are characterized by:…”
Section: Thermalmentioning
confidence: 99%
“…On the Cloud federation side, DISSECT-CF [238] proposes a model for energy consumption considering different components of PMs, without however considering RAM and thermal management. Some other simulators such as DCWorms [239] also propose to take into account during the simulation the thermal effects. Current simulation frameworks have mainly two limitations:…”
Section: Simulationmentioning
confidence: 99%
“…Stochastic simulations [240,241] Coverage No simulator is able to cover all the needed elements for Ultrascale simulations. Some works are trying to add the missing elements such as power and energy [242], Dynamic voltage and frequency scaling (DVFS) [243] or thermal simulation [239]. These improvements are in different simulators leading to difficulties to obtain a precise and global simulation taking into account all phenomenon.…”
Section: Simulationmentioning
confidence: 99%
“…This generic model is a starting point to provide individual estimations for particular components of M2DC box. For instance, to reflect the thermal behaviour of a processor we use the simplified version of the above model, benefiting from Newton's law of cooling, that is presented in [16].…”
Section: Thermal Managementmentioning
confidence: 99%