2017
DOI: 10.1063/1.4980153
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Energy band offsets of dielectrics on InGaZnO4

Abstract: Thin-film transistors (TFTs) with channels made of hydrogenated amorphous silicon (a-Si:H) and polycrystalline silicon (poly-Si) are used extensively in the display industry. Amorphous silicon continues to dominate large-format display technology, but a-Si:H has a low electron mobility, l $ 1 cm 2 /V s. Transparent, conducting metal-oxide materials such as Indium-Gallium-Zinc Oxide (IGZO) have demonstrated electron mobilities of 10-50 cm 2 /V s and are candidates to replace a-Si:H for TFT backplane technologie… Show more

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Cited by 77 publications
(53 citation statements)
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References 237 publications
(517 reference statements)
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“…In recent years, the thin‐film transistor (TFT) based on amorphous oxide semiconductor (AOS) have made an impressive progress for the applications in flat‐panel displays (FPDs), for example, active‐matrix liquid‐crystal display (AMLCD) and active‐matrix organic‐light‐emitting‐diode display (AMOLED) . Among them, amorphous InGaZnO (a‐IGZO) TFT is commonly used owing to its relatively high field‐effect mobility (µ FE , ≈10 cm 2 s −1 v −1 ) . However, the µ FE of a‐IGZO TFTs is still not high enough for more advanced applications such as three‐dimensional (3D) displays, flexible logic circuits, and system‐on‐panel devices …”
Section: Introductionmentioning
confidence: 99%
“…In recent years, the thin‐film transistor (TFT) based on amorphous oxide semiconductor (AOS) have made an impressive progress for the applications in flat‐panel displays (FPDs), for example, active‐matrix liquid‐crystal display (AMLCD) and active‐matrix organic‐light‐emitting‐diode display (AMOLED) . Among them, amorphous InGaZnO (a‐IGZO) TFT is commonly used owing to its relatively high field‐effect mobility (µ FE , ≈10 cm 2 s −1 v −1 ) . However, the µ FE of a‐IGZO TFTs is still not high enough for more advanced applications such as three‐dimensional (3D) displays, flexible logic circuits, and system‐on‐panel devices …”
Section: Introductionmentioning
confidence: 99%
“…[55][56][57][58][59][60] There are often variations in reported valence band offsets for dielectrics on semiconductors and some of the reasons documented include metal or carbon contamination, interfacial disorder, variations in dielectric composition, thermal conditions, strain, and surface termination effects. [59] Figure 10 shows there are differences of up to 1 eV in band alignments for SiO 2 and Al 2 O 3 on Ga 2 O 3 and (Al 0.14 Ga 0.86 ) 2 O 3 , depending on whether they are deposited by sputtering or Atomic Layer Deposition. In the case of Al 2 O 3 , this changed the band alignment from nested (type I) to staggered gap (type II).…”
Section: Gate Dielectrics For Mos Gatesmentioning
confidence: 99%
“…Furthermore, the carrier confinement and transport properties of a heterostructure depend on the band alignment of the buried interface, or equivalently on the Δ E C and Δ E V . XPS is a well‐established approach for the determination of band alignments of heterojunctions . Using XPS, the electrostatic potential at the interface can be monitored.…”
Section: Core Level (Cl) Spectra Of Corresponding Bulk and Heterojuncmentioning
confidence: 99%
“…Finally, high‐resolution survey scans with the step of 0.01 eV and pass energy of 20 eV were performed to acquire the binding energy of specific elements and valence band spectra (0–20 eV). In addition, the C 1s spectrum is separated into three peaks centered at (1) ∼284.8 eV, representing the CC bond, (2) ∼285.5 eV, representing the CO bond, and (3) ∼288.5 eV, representing the OCO bond . Then, all data are calibrated by referencing the peak location of the CC bond, and each core level (CL) spectrum is fitted using Lorentzian–Gaussian line shapes by employing a Shirley background subtraction.…”
Section: Core Level (Cl) Spectra Of Corresponding Bulk and Heterojuncmentioning
confidence: 99%