Enhanced diffusion caused by surface reactions in thin films of Sn–Cu–Mn

Oleshkevych, Аnna; Voloshko, S. М.; Sidorenko, S. I.; Langer, G.A.; Beke, Dezső L.; Rennie, Adrian R.

doi:10.1016/j.tsf.2013.10.143

Cited by 10 publications

(7 citation statements)

References 36 publications

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“…In addition from the slope of the same function of X versus t′ 1/2 plot (Fig.7b) the value of K can also be determined and it is K = 840 nm 2 /h. For the interpretation of the growth of the average composition near to the substrate in Cu, first we mention that in general diffusion along different grain boundaries can have important effects [12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28] on the overall intermixing process between two pure films. These processes can be well characterized by a bimodal GB network, with different (fast and slow) diffusivities.…”

Section: Discussionmentioning

confidence: 99%

“…The formation and growth of intermetallic compounds of Cu-Sn have been extensively studied [4][5][6][7][8][9][10][11][12][13]. In the pioneering works of Tu and his coworkers [3,14,15] the most important conclusions, obtained in thin film systems with Sn and Cu thicknesses in the range of 180-2500 nm, were as follows: i) The reaction between the Cu and Sn started spontaneously during the deposition at room temperature and led to the formation of Cu 6 Sn 5 phase.…”

Section: Introductionmentioning

confidence: 99%

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Formation of Cu6Sn5 phase by cold homogenization in nanocrystalline Cu–Sn bilayers at room temperature

Zaka

Shenouda

Fouad

et al. 2016

Microelectronics Reliability

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a b s t r a c tSolid state reaction between nanocrystalline Cu and Sn films was investigated at room temperature by depth profiling with secondary neutral mass spectrometry and by X-ray diffraction. A rapid diffusion intermixing was observed leading to the formation of homogeneous Cu 6 Sn 5 layer. There is no indication of the appearance of the Cu 3 Sn phase. This offers a way for solid phase soldering at low temperatures, i.e. to produce homogeneous Cu 6 Sn 5 intermediate layer of several tens of nanometers during reasonable time (in the order of hours or less). From the detailed analysis of the growth of the planar reaction layer, formed at the initial interface in Sn(100 nm)/Cu(50 nm) system, the value of the parabolic growth rate coefficient at room temperature is 2.3 × 10 −15 cm 2 /s. In addition, the overall increase of the composition near to the substrate inside the Cu film was interpreted by grain boundary diffusion induced solid state reaction: the new phase formed along the grain boundaries and grew perpendicular to the boundary planes. From the initial slope of the composition versus time function, the interface velocity during this reaction was estimated to be about 0.5 nm/h.

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Formation of Cu6Sn5 phase by cold homogenization in nanocrystalline Cu–Sn bilayers at room temperature

Zaka

Shenouda

Fouad

et al. 2016

Microelectronics Reliability

Self Cite

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“…Загальний парадокс тонкоплівкових станів полягає у тому, що послідовність фаз, які формуються, може істотно відрізнятися від послідовности, передбаченої діяграмами фазової рівноваги для відповідних масивних матеріялів. Така закономірність підтверджується, наприклад, для нанорозмірних систем Cu/Sn, Cu/Mn, Sn/Cu/Mn [2][3][4].…”

Section: вступunclassified

“…Аналогічний ефект спостерігається і за умов відпалу в атмосфері водню. Процеси гідридоутворення також стимулюють дифузію матеріялу «нижнього» шару межами зерен «верхнього» шару до зовнішньої поверхні нанорозмірної металевої композиції [4].…”

Section: вступunclassified

Effect of the ‘Diffusion Pump’ in Nanosize Metal Compositions

Oleshkevych¹,

Naumenko²,

Vladymyrskyi³

et al. 2016

Metallofiz. Noveishie Tekhnol.

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Проаналізовано процеси структурно-фазових перетворень в об'ємі та приповерхневих шарах нанорозмірної композиції Pd(30 нм)/Ho(20 нм)/SiO 2 при термічному впливі в рамках багатостадійного моделю дифузії як сукупності процесів масоперенесення за різними механізмами, розділеними за часом. Розглянуто ефект «дифузійного насосу», який полягає у тому, що при термічному обробленні в кисне-та водневмісних атмосферах фізико-хемічні процеси на зовнішній поверхні нанорозмірних металевих композицій термодинамічно визначають дифузійне фазоутворення в об'ємі.

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“…Different techniques were repeatedly applied to deposit the coating on the GCI’s surface. They are powder thermal spraying [ 17 ], arc spraying/sintering [ 18 ], physical vapor deposition [ 19 , 20 , 21 ], laser cladding [ 22 , 23 ], plasma surfacing [ 24 , 25 , 26 ], plasma spraying [ 27 , 28 ], electric contact deposition [ 29 ], etc., which were previously reported to improve GCI’s resistance to abrasive wear, corrosion, thermal fatigue, and cavitation damage.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of the Microstructure, Tribological Characteristics, and Crack Behavior of a Chromium Carbide Coating Fabricated on Gray Cast Iron by Pulsed-Plasma Deposition

et al. 2021

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The structural and tribological properties of a protective high-chromium coating synthesized on gray cast iron by air pulse-plasma treatments were investigated. The coating was fabricated in an electrothermal axial plasma accelerator equipped with an expandable cathode made of white cast iron (2.3 wt.% C–27.4 wt.% Cr–3.1 wt.% Mn). Optical microscopy, scanning electron microscopy, energy-dispersive spectroscopy, X-ray diffraction analysis, microhardness measurements, and tribological tests were conducted for coating characterizations. It was found that after ten plasma pulses (under a discharge voltage of 4 kV) and post-plasma heat treatment (two hours of holding at 950 °C and oil-quenching), a coating (thickness = 210–250 µm) consisting of 48 vol.% Cr-rich carbides (M7C3, M3C), 48 vol.% martensite, and 4 vol.% retained austenite was formed. The microhardness of the coating ranged between 980 and 1180 HV. The above processes caused a gradient in alloying elements in the coating and the substrate due to the counter diffusion of C, Cr, and Mn atoms during post-plasma heat treatments and led to the formation of a transitional layer and different structural zones in near-surface layers of cast iron. As compared to gray cast iron (non-heat-treated and heat-treated), the coating had 3.0–3.2 times higher abrasive wear resistance and 1.2–1208.8 times higher dry-sliding wear resistance (depending on the counter-body material). The coating manifested a tendency of solidification cracking caused by tensile stress due to the formation of a mostly austenitic structure with a lower specific volume. Cracks facilitated abrasive wear and promoted surface spalling under dry-sliding against the diamond cone.

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Enhanced diffusion caused by surface reactions in thin films of Sn–Cu–Mn

Cited by 10 publications

References 36 publications

Formation of Cu6Sn5 phase by cold homogenization in nanocrystalline Cu–Sn bilayers at room temperature

Formation of Cu6Sn5 phase by cold homogenization in nanocrystalline Cu–Sn bilayers at room temperature

Effect of the ‘Diffusion Pump’ in Nanosize Metal Compositions

Evaluation of the Microstructure, Tribological Characteristics, and Crack Behavior of a Chromium Carbide Coating Fabricated on Gray Cast Iron by Pulsed-Plasma Deposition

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