2015
DOI: 10.1039/c4ce01890g
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Enhanced features of Li2CO3 sputtered thin films induced by thickness and annealing time

Abstract: Li 2 CO 3 sputtered films of 300 nm have been subjected to physical and electrochemical characterization methods to analyze the influence of annealing treatments at 600°C for 2 h, 6 h, 12 h and 18 h on the microstructure, surface and conductivity. X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), atomic force microscopy (AFM) and electrochemical impedance spectroscopy (EIS) have been used for this purpose. XRD and FT-IR have illustrated the evolution of the microstructure with annealing… Show more

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Cited by 17 publications
(8 citation statements)
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“…described. [22,23] In brief, a 200 nm gold layer was deposited by RF magnetron sputtering (Edwards coating system E306A) in an argon (Ar) atmosphere onto positive photoresist previously patterned employing a photolithographic process. An 8 nm layer of titanium (Ti) as adhesion layer was deposited by DC magnetron sputtering.…”
Section: Fabrication Of the Electrochemical Device And Integration Wi...mentioning
confidence: 99%
“…described. [22,23] In brief, a 200 nm gold layer was deposited by RF magnetron sputtering (Edwards coating system E306A) in an argon (Ar) atmosphere onto positive photoresist previously patterned employing a photolithographic process. An 8 nm layer of titanium (Ti) as adhesion layer was deposited by DC magnetron sputtering.…”
Section: Fabrication Of the Electrochemical Device And Integration Wi...mentioning
confidence: 99%
“…Transparent conducting electrodes with excellent electrical and optical properties were fabricated by a merger of photolithographic structuring and ALD thin film growth. The fabrication process has been adapted from protocols described in literature and is schematically outlined in Figure a. In a typical process, the substrate was spin‐coated (Figure a‐(2)) with a positive photoresist, subsequently exposed to UV light through a photomask to transfer the interdigitated pattern (Figure a‐(3)) and the exposed photoresist was then removed by dissolution (Figure a‐(4)).…”
Section: Resultsmentioning
confidence: 99%
“…All the metallic layers were annealed at 600 °C during two hours (step 5). Finally, the deposition of the auxiliary phase (AP) of 300 nm of Li 2 CO 3 (step 6) was performed as described in previous works . The auxiliary phase (AP) was patterned by photolithographic techniques in an interdigitated shape to maximize the contact area among AP, the electrolyte and the SE.…”
Section: Resultsmentioning
confidence: 99%