Enhanced shear strength of Cu–Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process

Liu, Baolei; Tian, Yanhong; Feng, Jie; Wang, Chenxi

doi:10.1007/s10853-016-0483-6

Cited by 37 publications

(8 citation statements)

References 49 publications

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“…The electric current was supplied by DC power. In Liu’s study 13 , the electric current density was as high as 10 4 A/cm 2 , completing the reaction in only 30 ms, which was not able to observe the reaction process. In order to slow the growth of Cu-Sn IMC, smaller electric current densities were chosen: 1.0 × 10 2 A/cm 2 and 2.0 × 10 2 A/cm 2 in this study.…”

Section: Methodsmentioning

confidence: 89%

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Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current

Feng

Hang

Tian

et al. 2018

Sci Rep

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In this paper, electric currents with the densities of 1.0 × 102 A/cm2 and 2.0 × 102 A/cm2 were imposed to the Cu-liquid Sn interfacial reaction at 260 °C and 300 °C with the bonding times from 15 min to 960 min. Unlike the symmetrical growth following a cubic root dependence on time during reflowing, the Cu6Sn5 growth enhanced by solid-liquid electromigration followed a linear relationship with time. The elevated electric current density and reaction temperature could greatly accelerate the growth of Cu6Sn5, and could induce the formation of cellular structures on the surfaces because of the constitutional supercooling effect. A growth kinetics model of Cu6Sn5 based on Cu concentration gradient was presented, in which the dissolution of cathode was proved to be the controlling step. This model indicates that higher current density, higher temperature and larger joint width were in favor of the dissolution of Cu. Finally, the shear strengths of joints consisted of different intermetallic compound microstructures were evaluated. The results showed that the Cu6Sn5-based joint could achieve comparable shear strength with Sn-based joint.

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Section: Methodsmentioning

confidence: 89%

“…Liu et al . 13 imposed an electric current density of 1.44 × 10 4 A/cm 2 on Cu/Sn/Cu system to fabricate the Cu-Sn interconnections within 180 ms, and achieved a shear strength as high as 67.3 MPa. Ma et al .…”

Section: Introductionmentioning

confidence: 99%

Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current

Feng

Hang

Tian

et al. 2018

Sci Rep

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“…Sn and Sn alloys such as Sn-Ag have been used in a variety of applications, such as lithium batteries, printed electronics, electrochemical sensing and so on. [7][8][9][10][11] To the best of our knowledge, Sn and its alloys Sn-Ag and Sn-Cu have not been used in the photocatalysis field. In the present work, we prepare Sn, Sn-Cu, and Sn-Ag nanostructures by the galvanic displacement method.…”

Section: Introductionmentioning

confidence: 99%

Novel flower‐like Sn–Cu and cactus‐like Sn–Ag nanocatalysts for photo catalytically removal of toxic pollutant

Mawlud

Ahmed

Mortazavi‐Derazkola

et al. 2020

Applied Organom Chemis

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In this study, dendrite-like Sn nanocomposites were achieved by engineering the synthesis parameters. The dendritic Sn nanostructures show higher photocatalytic activity compared to nanoplate Sn and hierarchical Sn nanostructures. Flower-like Sn-Cu and cactus-like SnAg nanostructures were prepared to improve the photocatalytic activity of Sn nanostructures. Adding Cu and Ag improved the photocatalytic activity of Sn by 24% and 46%, respectively. The photodegradation results revealed that the cactus-like SnAg has a high degradation rate (5.3 × 10 −4 mmol L −1 min −1) compared to the Sn nanostructures (2.9 × 10 −4 mmol L −1 min −1). This work provides new insight into the design of highly efficient photocatalysts by engineering the morphology.

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“…Свойства интерметаллидов Cu 3 Sn и Cu 6 Sn 5 имеют существенное значение для микроэлектроники в связи с неконтролируемым их образованием на границе раздела медь−олово, что приводит к возникновению локальных напряжений и развитию трещин, и оказывает негативное влияние на прочность паяных контактов [1,2]. Разрушение контакта происходит, как правило, по интерметаллическому слою [3,4], хотя небольшой слой интерметаллической фазы может оказывать положительное влияние, увеличивая прочность сцепления припоя с подложкой [5][6][7].…”

Section: Introductionunclassified

Субструктура интерметаллического соединения Cu-=SUB=-3-=/SUB=-Sn в тонкопленочном состоянии

Makrushina¹,

Плотников²,

Демьянов³

et al. 2019

Журнал Технической Физики

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The crystalline structure of intermetallic Cu_3Sn synthesized by successively condensing thin layers of copper and tin on a substrate at 150°C has been studied. Cu_3Sn compound exists in a very narrow homogeneity range and has a long-period close-packed ordered D0_19 superstructure. It has been found that the crystal lattice exhibits many slip traces associated with dislocation motion. The dislocation motion is due to the stressed state of the crystal, which can be characterized as uniform extension. Electron micrographs show that slip traces in the Cu_3Sn crystal are parallel to the ( $$\bar {1}\bar {1}21$$ ) and ( $$11\bar {2}1$$ ) planes belonging to pyramidal slip system II, which is a main slip system along with pyramidal and basal ones. Slip traces result from the motion of partial dislocations, as indicated by the amount of slip, which is equal to half the interplanar distance. Since the crystal is ordered, slip is accomplished by a pair of superpartial dislocations and a slip trace may be a superstructural or complex stacking fault.

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Enhanced shear strength of Cu–Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process

Cited by 37 publications

References 49 publications

Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current

Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current

Novel flower‐like Sn–Cu and cactus‐like Sn–Ag nanocatalysts for photo catalytically removal of toxic pollutant

Субструктура интерметаллического соединения Cu-=SUB=-3-=/SUB=-Sn в тонкопленочном состоянии

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