Enhanced thermal conductivity and mechanical properties of polymeric composites through formation of covalent bonds between boron nitride and rubber chains

Yang, Dan; Wei, Qungui; Yu, Liyuan; Zhao, Chengwang; Zhang, Liqun

doi:10.1002/pat.5506

Cited by 13 publications

(4 citation statements)

References 39 publications

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“…In a first approach, BN was used as such. However, as would be expected and as shown in the literature [25], one of the main factors limiting heat transfer in composites with such filler is the low compatibility between BN and the matrix. To minimize this disadvantage, various filler treatments are reported in the literature, such as exfoliation, ball milling, oxidation, or treatment with organic compounds (e.g., poly(dopamine) [8] or polyrhodanine [25]) and/or silane coupling agents (e.g., γ-methacryloxypropyltrimethoxysilane, KH570 [8]), each with their own advantages and disadvantages [7,8].…”

Section: Resultssupporting

confidence: 59%

“…However, as would be expected and as shown in the literature [25], one of the main factors limiting heat transfer in composites with such filler is the low compatibility between BN and the matrix. To minimize this disadvantage, various filler treatments are reported in the literature, such as exfoliation, ball milling, oxidation, or treatment with organic compounds (e.g., poly(dopamine) [8] or polyrhodanine [25]) and/or silane coupling agents (e.g., γ-methacryloxypropyltrimethoxysilane, KH570 [8]), each with their own advantages and disadvantages [7,8]. Thermally conductive silicone materials on the market are of undisclosed composition, so one of the main ideas of this study was to obtain such materials with customized silicone formulation, based on own component and protocols developed in the laboratory.…”

Section: Resultssupporting

confidence: 59%

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Scalable Silicone Composites for Thermal Management in Flexible Stretchable Electronics

Stiubianu¹,

Bele²,

Grigoraş

et al. 2022

Batteries

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Hexagonal boron nitride (hBN) has been incorporated, as an active filler, in a customized silicone matrix to obtain high thermal conductivity composites, maintaining high flexibility and low dielectric permittivity, which are of interest for heat dissipation in energy storage systems (e.g., batteries or supercapacitors) and electronics. By the proper processing of the filler (i.e., hydrophobization with octamethylcyclotetrasiloxane and ultrasonic exfoliation) and its optimal loading (i.e., 10 wt%), composites with thermal conductivity up to 3.543 W·m−1·K−1 were obtained. Conductive heat flow (−280.04 W), measured in real heating–cooling conditions, proved to be superior to that of a commercial heatsink paste (−161.92 W), which has a much higher density (2.5 g/cm3 compared to 1.05 g/cm3 of these composites). The mechanical and electrical properties are also affected in a favorable way (increased modulus and elongation, low dielectric losses, and electrical conductivity) for applications as thermal management materials.

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Section: Resultssupporting

confidence: 59%

Section: Resultssupporting

confidence: 59%

Scalable Silicone Composites for Thermal Management in Flexible Stretchable Electronics

Stiubianu¹,

Bele²,

Grigoraş

et al. 2022

Batteries

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“…25, 26 Yu 27 et al prepared BN-TA filler by chemically non-covalent modification of h-BN with tannic acid (TA) to improve the thermal conductivity of XNBR composites. Yang 28 et al prepared functionalized h-BN-PRd by modifying h-BN using polyrhodanine (PRd) and dispersed it into the NBR matrix. The thermal conductivity of NBR reached 0.40 W/mK when 30 vol% of h-BN-PRd was added, which was 135% higher than that of pure NBR (0.17 W/mK).…”

Section: Introductionmentioning

confidence: 99%

Co-modified h-BN was used to improve the mechanical properties and thermal conductivity of natural rubber

Yang

et al. 2023

Journal of Elastomers & Plastics

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With the rapid development of electronic devices and rubber tires, the industry has put forward new requirements for the heat dissipation of rubber components. With excellent thermal conductivity, oxidation resistance, and thermal stability, hexagonal boron nitride (h-BN) is often added to plastics or rubber as a thermally conductive filler, but is less effective when used directly. In this study, h-BN-K was prepared by direct modification of the mixed solution of KH-550, and KH-570, while h-BN-PK was prepared by co-modification of dopamine, KH-550, and KH-570. Two modified h-BN were added to natural rubber (NR) to improve the vulcanization properties, mechanical properties, and thermal conductivity. It was found that the tensile strength and thermal conductivity of 20 wt% h-BN-PK/NR composites were 30.6 MPa and 0.335 W/mK, which were 39.1% and 110.7% higher compared to pure NR (22.0 MPa and 0.159 W/mK), respectively. In addition, the addition of h-BN improved the thermal stability performance of NR to some extent. In conclusion, the h-BN-PK/NR composites provide a certain reference for the use of thermally conductive NR and suggest new ideas for heat dissipation of electronic devices.

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“…Improving the thermal conductivity (λ) of a polymer is an effective and easy method to spread the accumulated heat in a quick way. 5,6 This can be realized by incorporating thermally conductive fillers including ceramic particles such as silicon carbide (SiC), 7,8 aluminum oxide (Al 2 O 3 ), 9,10 and boron nitride (BN), 11,12 carbon materials such as carbon nanotubes (CNT) 13 and graphene oxide (GO), 14,15 and metal particles such as silver (Ag) and copper (Cu) into a polymeric matrix. 16,17 Though a small amount of carbon materials and metal particles can substantially enhance the λ value of polymeric composites, the sharply increased electrical conductivity limits their applications in the field of insulation.…”

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confidence: 99%

Constructing “sesame‐biscuit” structured hybrids with SiC and Ag particles for enhancing thermal conductivity and dielectric constant of elastomer composites

Wang

Yang

2023

Polymers for Advanced Techs

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With the development of multifunctional and miniaturized integrated circuits, polymeric materials with large dielectric constant and high thermal conductivity have major significance in modern electronic industry. In this work, “sesame‐biscuit” structured thermally conductive hybrids were prepared by polydopamine (PDA) modification and in‐situ electroless silver (Ag) plating on the surface of silicon carbide (SiC), referred as SiC‐P‐Ag. Then, the SiC‐P‐Ag was incorporated into epoxidized natural rubber (ENR) matrix to yield polymeric composites (ENR/SiC‐P‐Ag) with excellent thermal and dielectric properties. It was found that PDA improved the interfacial compatibility and reduced the interface thermal resistance between SiC and ENR matrix. In addition, the formation of heat conduction channels and conductive Ag nanoparticles caused an increase in thermal conductivity of the 50 vol% ENR/SiC‐P‐Ag composite to 0.5655 W/(mK), which was 540% that of the pure ENR (0.1048 W/(mK)). Meanwhile, the 50 vol% ENR/SiC‐P‐Ag composite showed a low AC conductivity of 2.98 × 10−11 S/cm and a high dielectric constant of 35 at 10 Hz. It is noteworthy that this simple and efficient route for preparing ENR/SiC‐P‐Ag composites can also be applied in other fillers for simultaneously enhancing dielectric constant and thermal conductivity of polymeric composites.

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Enhanced thermal conductivity and mechanical properties of polymeric composites through formation of covalent bonds between boron nitride and rubber chains

Cited by 13 publications

References 39 publications

Scalable Silicone Composites for Thermal Management in Flexible Stretchable Electronics

Scalable Silicone Composites for Thermal Management in Flexible Stretchable Electronics

Co-modified h-BN was used to improve the mechanical properties and thermal conductivity of natural rubber

Constructing “sesame‐biscuit” structured hybrids with SiC and Ag particles for enhancing thermal conductivity and dielectric constant of elastomer composites

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