2022
DOI: 10.1002/app.52629
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Enhanced thermal conductivity of epoxy acrylate/h‐BN and AlN composites by photo‐curing 3D printing technology

Abstract: Filling hexagonal boron nitride (h‐BN) is a hot topic in the research of improving the thermal conductivity of polymer composites. Conversely, its difficulty in dispersing and forming a three‐dimensional thermal network has become a major problem. This article uses liquid resin can effectively help the filler to be evenly dispersed and construct a multi‐layer connection network through 3D printing technology, which improves the thermal conductivity of polymer effectively. With the addition of 30 wt% h‐BN, the … Show more

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Cited by 12 publications
(4 citation statements)
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“…3D printing technology can facilitate the uniform dispersion of thermally conductive fillers within the polymer matrix, reducing the defects caused by filler agglomeration, thereby diminishing phonon scattering and enhancing the thermal conductivity of the composites. Lin et al 169 utilized VP 3D printing technology to uniformly disperse hBN thermally conductive fillers into epoxy acrylate (EA) resin. The results showed that when the mass fraction of hBN was 30 wt%, the λ of the hBN/EA composites reached 1.60 W m –1 K –1 , which was 6.8 times higher than that of pure EA (0.21 W m –1 K –1 ).…”
Section: Structure and Function Integration Of Polymer Composites Via...mentioning
confidence: 99%
“…3D printing technology can facilitate the uniform dispersion of thermally conductive fillers within the polymer matrix, reducing the defects caused by filler agglomeration, thereby diminishing phonon scattering and enhancing the thermal conductivity of the composites. Lin et al 169 utilized VP 3D printing technology to uniformly disperse hBN thermally conductive fillers into epoxy acrylate (EA) resin. The results showed that when the mass fraction of hBN was 30 wt%, the λ of the hBN/EA composites reached 1.60 W m –1 K –1 , which was 6.8 times higher than that of pure EA (0.21 W m –1 K –1 ).…”
Section: Structure and Function Integration Of Polymer Composites Via...mentioning
confidence: 99%
“…For this reason, numerous researchers have developed composite polymers with excellent heat dissipation capabilities using CNTs with high thermal conductivity and BN with insulating properties as hybrid fillers. Lin et al 62 used micron‐sized hexagonal BN (h‐BN), CNTs, and nano‐sized h‐BN with 3D printing applications and achieved a thermal conductivity of 1.77 W m −1 K −1 with a filler content of 40 wt%. Bozkurt et al 63 used h‐BN and aluminum nitride with a 3D printing process and achieved a thermal conductivity of 1.60 W m −1 K −1 with a filler content of 30 wt%.…”
Section: Introductionmentioning
confidence: 99%
“…61 For this reason, numerous researchers have developed composite polymers with excellent heat dissipation capabilities using CNTs with high thermal conductivity and BN with insulating properties as hybrid fillers. Lin et al 62…”
mentioning
confidence: 99%
“…When the Al 2 O 3 filling amount was 26.67 wt% and BN filling amount is 13.33 wt%, the thermal conductivity of the composite material was improved to 1.192 W/(m·K), which was 654.9% of that of pure epoxy resin 45 . Lin et al used 3D printing technology to fill 15 wt% h‐BN and 30 wt% AlN blend into liquid photosensitive resin, resulting in an increase in the thermal conductivity of the composite material to 1.31 W/(m·K) 46 . Feng et al filled Al 2 O 3 and BN blended into silicone rubber by hot pressing method.…”
Section: Introductionmentioning
confidence: 99%