Enhanced thermal conductivity of low-temperature sintered borosilicate glass–AlN composites with β-Si3N4 whiskers

High Thermal Conductivity Ceramics and Their Composites for Thermal Management of Integrated Electronic Packaging

“…This enhanced High Thermal Conductivity Ceramics and Their Composites for Thermal Management… http://dx.doi.org/10.5772/intechopen.75798 thermal conductivity may be due to the formation of a thermal conducting path by bridging the isolated AlN particles through β-Si 3 N 4 whiskers. The dielectric properties of this composites are ε r = 6.5 and tan δ = 0.0016 at 1 MHz, and the values are not significantly changed with the amount of whiskers due to their similarity in dielectric properties between AlN and Si 3 N 4 [53].…”

“…Microstructural manipulations such as filler particle re-orientation, low thermal conductivity, secondary phase removal, and grain boundary control are also explored. Among them, some of key research works are summarized in Table 6 [33,[45][46][47][48][49][50][51][52][53].…”

Suppression of Silver Diffusion in Borosilicate Glass‐Based Low‐Temperature Cofired Ceramics by Copper Oxide Addition

“…52 CABS1–48 Al 2 O 3 (wt%, LTCC1) and 52 CABS2–48 Al 2 O 3 (wt%, LTCC2) were tape‐casted. Details on glass powders and LTCC green tapes preparation can be found in our previous papers . Commercial silver paste (Dupont 6142D, Santa Barbara, CA) was used for cofiring investigation.…”

Enhanced ferromagnetic properties of low temperature sintering LiZnTi ferrites with Li2O–B2O3–SiO2–CaO–Al2O3 glass addition

“…However, LiZnTi ferrites do not meet the basic requirements with regard to sinterability for LTCC technology since they have relatively high sintering temperature [5][6][7]. The addition of borosilicate glasses is an effective way to decrease the firing temperature in LTCC materials [8][9][10][11][12][13][14]. Those glasses exhibit a softening point of $700°C and have a crucial influence on the viscosity of the melt during the firing as described by the Mauro-Yue-Ellison-Gupta-Allan (MYEGA) equation [15]: log 10 gðTÞ ¼ log 10 g 1 þ ð12 À log 10 g 1 Þ Tg T exp m 12Àlog 10 g 1 À 1 h Tg T À 1 i ; where T g is the glass-transition temperature, defined by log 10 gðT g Þ ¼ 10 12 Pa s [16], m is the liquid fragility index, defined by m ¼ @log 10 gðTÞ @ðTg=TÞ T¼Tg [17].…”