2022
DOI: 10.1039/d2nr02421g
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Enhanced thermal transportation across an electrostatic self-assembly of black phosphorene and boron nitride nanosheets in flexible composite films

Abstract: Heat dissipation of portable electronics is in great demand of lightweight and flexible films with superior thermal transport properties. Despite extensive efforts, enhancing the intrinsic low thermal conductivity of polymers...

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Cited by 15 publications
(8 citation statements)
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“…Boron nitride nanosheets (BNNS) were stripped using a homemade device, refer to our previous paper for details on the BNNS stripping process. [38][39][40] Polydimethylsiloxane (PDMS, Sylgard 184 Silicone Elastomer, USA) and silicone oil DC-200 (viscosity ∼10 mPa s, at 25 °C) were provided by Dow Corning Co., Ltd. A commercial carbon ber TIM pad (WT5902, k = 25 W m −1 K −1 ) was purchased from Tianjin WaermTimo New Material Technology Corp., Ltd (Tianjin, China).…”
Section: Methodsmentioning
confidence: 99%
“…Boron nitride nanosheets (BNNS) were stripped using a homemade device, refer to our previous paper for details on the BNNS stripping process. [38][39][40] Polydimethylsiloxane (PDMS, Sylgard 184 Silicone Elastomer, USA) and silicone oil DC-200 (viscosity ∼10 mPa s, at 25 °C) were provided by Dow Corning Co., Ltd. A commercial carbon ber TIM pad (WT5902, k = 25 W m −1 K −1 ) was purchased from Tianjin WaermTimo New Material Technology Corp., Ltd (Tianjin, China).…”
Section: Methodsmentioning
confidence: 99%
“…A cellulose nanofiber‐based film was fabricated with the functionalized boron nitride nanosheets (f‐BNNS) and black phosphorene (BP) (published in Nanoscale 47 ). In that work, the BP/CNF film, the f‐BNNS/CNF film and the BP/f‐BNNS/CNF film showed the through‐plane thermal conductivities (th‐TC) of 3.06, 0.9, and 0.83 W/m K), respectively.…”
Section: Applicationmentioning
confidence: 99%
“…The scanning electron microscopic image of the BP/CNF film (A), the f‐BNNS/CNF film (C) and the BP/f‐BNNS/CNF film (E), respectively. Reproduced with permission 47 . Copyright 2022, Royal Society of Chemistry.…”
Section: Applicationmentioning
confidence: 99%
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“…Therefore, the industry generally believes that the bottleneck of the future development of electronic products is not the hardware or heat dissipation design, but whether effective heat dissipation materials can be prepared to solve the thermal failure problem in the operation of modern electronic products. Polymers are widely used in electronic packaging, thermally conductive adhesives, and other fields because of their chemical stability, good insulation, and industrial production [ 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 ]. However, most of the polymer materials are poor thermal conductors with low thermal conductivity, generally between 0.1–0.5 W·m −1 ·K − 1 , which greatly limits their wider applications [ 17 , 18 ].…”
Section: Introductionmentioning
confidence: 99%