Enhancement of IBIS modeling capability in simutanous switching noise (SSN) and other power integrity related simulations - proposal, implementation, and validation

Yang, Zhiping; Huq, S. M. Ishraqul; Arumugham, Vinu; Park, Ilyoung

doi:10.1109/isemc.2005.1513598

Cited by 5 publications

(1 citation statement)

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“…The ICEM [5] and LECCS [6] models were developed to model the noise conducted through the IC power delivery network in order to facilitate better prediction of board-level emissions. Similar models are being explored to predict noise coupled through I/O [7], [8], [9].…”

Section: Introductionmentioning

confidence: 99%

Application of chip-level EMC in automotive product design

Weng

Beetner

et al. 2006

2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006.

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Integrated circuits (ICs) are often the source of the high-frequency noise that drives electromagnetic emissions from electronic products. A case study is presented where emissions from a printed circuit board containing an automotive microcontroller are reduced significantly through analysis of the coupling mechanisms from the chip to the board and attached cables. Noise generated by the IC is explored through measurements in a semi-anechoic chamber and TEM cell, through near-field scans, and through modifications to the printed circuit board. Noise is driven by the IC through both power and I/O connections. Results show that a ferrite in series with I/O power in this application reduced emissions by 10 dB or more at critical frequencies. Possible causes for emissions from the IC and modifications that might reduce these emissions are discussed.

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Section: Introductionmentioning

confidence: 99%

Application of chip-level EMC in automotive product design

Weng

Beetner

et al. 2006

2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006.

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Evaluation of IBIS modelling techniques for signal integrity simulations without and with package parasitics

Mouthaan

Venkatarayalu

2010

2010 IEEE Electrical Design of Advanced Package &Amp; Systems Symposium

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Developing Improved IO Buffer Behavioral Modeling Methodology Based on IBIS

Varma

Steer

Franzon

2006

2006 IEEE Electrical Performane of Electronic Packaging

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A new macromodeling methodology based on IBIS (Input/Output Buffer Information Specification) models is proposed. IBIS models are known to lack information regarding power and ground bounce [2][5] resulting in incorrect system level simulations. The new macromodel works with available simulators and produces models that can be simulated accurately for Simultaneous Switching Noise (SSN). To demonstrate the solution, a CMOS voltagemode driver circuit and a MICRON DDR2 driver are simulated using HSPICE and compared with equivalent circuits created with IBIS models ofthe same drivers.

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Enhancement of IBIS modeling capability in simutanous switching noise (SSN) and other power integrity related simulations - proposal, implementation, and validation

Cited by 5 publications

References 1 publication

Application of chip-level EMC in automotive product design

Application of chip-level EMC in automotive product design

Evaluation of IBIS modelling techniques for signal integrity simulations without and with package parasitics

Developing Improved IO Buffer Behavioral Modeling Methodology Based on IBIS

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