Enhancement of structural and microwave properties of Zn2+ ion-substituted Li2MgSiO4 ceramics for LTCC applications

Su, Haokai; Sun, Yang; Wang, Gang; Gao, Feng; Han, Xuening; Liang, Zheng; Li, Qiang

doi:10.1016/j.ceramint.2021.02.060

Cited by 13 publications

(2 citation statements)

References 21 publications

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“…Low-temperature co-fired ceramics (LTCCs) represent one of the most important technologies due to growing interest in miniaturized and integrated devices. LTCCs are multilayered ceramic materials that are notable for their remarkable physical and chemical properties [ 1 , 2 , 3 , 4 , 5 , 6 ]. LTCC technology is also used to make antennas, telescope mirror blanks, and sensors.…”

Section: Introductionmentioning

confidence: 99%

Effect of Al2O3 and ZrO2 Filler Material on the Microstructural, Thermal and Dielectric Properties of Borosilicate Glass-Ceramics

et al. 2023

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Various glass-ceramics are widely used or considered for use as components of microelectronic materials due to their promising properties. In this study, borosilicate glass was prepared using the powder metallurgical route and then mixed with different amounts of Al2O3 and ZrO2 filler materials. Glass-ceramics are produced by high-energy ball milling and conventional sintering process under Ar or air. In this study, the effects of different filler materials and different atmospheres on the microstructural, thermal and dielectric properties were investigated. The data showed that ZrO2 filler material led to better results than Al2O3 under identical working conditions and similar composite structures. ZrO2 filler material significantly enhanced the densification process of glass-ceramics (100% relative density) and led to a thermal conductivity of 2.904 W/K.m, a dielectric constant of 3.97 (at 5 MHz) and a dielectric loss of 0.0340 (at 5 MHz) for the glass with 30 wt.% ZrO2 sample. This paper suggests that prepared borosilicate glass-ceramics have strong sinterability, high thermal conductivity, and low dielectric constants, making them promising candidates for microelectronic devices.

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Section: Introductionmentioning

confidence: 99%

Effect of Al2O3 and ZrO2 Filler Material on the Microstructural, Thermal and Dielectric Properties of Borosilicate Glass-Ceramics

et al. 2023

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“…The significant characteristics of LTCC are excellent dielectric properties, high thermal conductivity, cost-effectiveness, and sintering temperature below the melting points of metal electrodes (Ag or Cu or Au). Thus, sintering below 950 • C makes it unique for miniaturized and integrated electronic devices [1,3,4,7,8,11,[19][20][21][22]. Besides, glass content embedded in a ceramic system provides multifunctional characteristics, such as high strength and high durability [10,14,23].…”

Section: Introductionmentioning

confidence: 99%

Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions

Arıbuğa

Akkasoglu²,

Çiçek

et al. 2022

Materials

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With the rapid development of the microelectronics industry, many efforts have been made to improve glass-ceramics’ sinterability, thermal conductivity, and dielectric properties, which are essential components of electronic materials. In this study, low-alkali borosilicate glass-ceramics with PVA addition and glass-BN composites were prepared and successfully sintered at 770 °C. The phase composition, density, microstructure, thermal conductivity, and dielectric constant were investigated. It was shown that PVA addition contributes to the densification process of glass-ceramics (~88% relative density, with closed/open pores in the microstructure) and improves the thermal conductivity of glass material from 1.489 to 2.453 W/K.m. On the other hand, increasing BN addition improves microstructures by decreasing porosities and thus increasing relative densities. A glass-12 wt. % BN composite sample exhibited almost full densification after sintering and presented apparent and open pores of 2.6 and 0.08%, respectively. A high thermal conductivity value of 3.955 W/K.m and a low dielectric constant of 3.00 (at 5 MHz) were observed in this material. Overall, the resulting glass-ceramic samples showed dielectric constants in the range of 2.40–4.43, providing a potential candidate for various electronic applications.

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Enhanced structure and microwave dielectric properties of low-temperature sintering Li2Mg1 − xCaxSiO4 ceramics by Ca2+ ion substitution

Li,

Chen

et al. 2023

J Electroceram

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Enhancement of structural and microwave properties of Zn2+ ion-substituted Li2MgSiO4 ceramics for LTCC applications

Cited by 13 publications

References 21 publications

Effect of Al2O3 and ZrO2 Filler Material on the Microstructural, Thermal and Dielectric Properties of Borosilicate Glass-Ceramics

Effect of Al2O3 and ZrO2 Filler Material on the Microstructural, Thermal and Dielectric Properties of Borosilicate Glass-Ceramics

Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions

Enhanced structure and microwave dielectric properties of low-temperature sintering Li2Mg1 − xCaxSiO4 ceramics by Ca2+ ion substitution

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