Enhancement of the Load Capacity of High-Energy Laser Monocrystalline Silicon Reflector Based on the Selection of Surface Lattice Defects

Abstract

Various defects during the manufacture of a high-energy laser monocrystalline silicon reflector will increase the energy absorption rate of the substrate and worsen the optical properties. Micron-scale or larger manufacturing defects have been inhibited by mechanism study and improvement in technology, but the substrate performance still fails to satisfy the application demand. We focus on the changes in the optical properties affected by nanoscale and Angstrom lattice defects on the surface of monocrystalline silicon and acquire the expected high reflectivity and low absorptivity through deterministic control of its defect state. Based on the first principles, the band structures and optical properties of two typical defect models of monocrystalline silicon—namely, atomic vacancy and lattice dislocation—were analyzed by molecular dynamics simulations. The results showed that the reflectivity of the vacancy defect was higher than that of the dislocation defect, and elevating the proportion of the vacancy defect could improve the performance of the monocrystalline silicon in infrared (IR) band. To verify the results of simulations, the combined Ion Beam Figuring (IBF) and Chemical Mechanical Polishing (CMP) technologies were applied to introduce the vacancy defect and reduce the thickness of defect layer. After the process, the reflectivity of the monocrystalline silicon element increased by 5% in the visible light band and by 12% in the IR band. Finally, in the photothermal absorption test at 1064 nm, the photothermal absorption of the element was reduced by 80.5%. Intense laser usability on the monocrystalline silicon surface was achieved, and the effectiveness and feasibility of deterministic regulation of optical properties were verified. This concept will be widely applied in future high-energy laser system and X-ray reflectors.

Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon

“…Owing to its excellent mid-to short-spatial-period error control with a root-meansquare (RMS) roughness value in the subnanometer level [1], chemical-mechanical polishing (CMP) has been applied for monocrystalline silicon mirror fabrication in the aerospace industry and high energy beam system domains [2][3][4][5]. Microscale surface morphology is a direct source for silicon mirror evaluations of mid-to short-spatial-period errors during CMP.…”