Enhancing the lifetime prediction methodology for photovoltaic modules based on electronic packaging experience

Guyenot, M.; Peter, E.; Zerrer, Patrick; Kraemer, Frank Alexander; Wiese, S.

doi:10.1109/esime.2011.5765781

Cited by 7 publications

(10 citation statements)

References 2 publications

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“…Likewise, Kumar and Sarkar [27] conducted a single constant stress accelerated life test on 20 PV modules for stress failure and obtained the least survival life to be 21 years (11497 cycles to failure). Table 3 presents predicted solder joint fatigue life of model compared with the expected life determined by Guyenot et al [24] as well as test lives obtained by Kohl et al [25] and that of Kumar and Sarkar [27]. An observation of values in Table 3 indicates that fatigue life of the geometric model under consideration obtained from the use of accumulated creep strain energy is well within the range when compared with test results.…”

Section: Discussionmentioning

confidence: 70%

“…It was earlier stated in sub-section 3.2.2 that fatigue life is measured in number of repetitions or cycles to failure. In that regard, Guyenot et al [24] estimated that for 1.5 thermal cycles per day with a temperature change of about 50 o C, expected life of solder joints in PV modules designed to last for 25 years is 13688 cycles to failure. On the other hand, Kohl et al [25] in SunPower [26] reported that in a German four-year project, a group of PV modules from 7 different manufacturers were subjected to damp heat ageing test.…”

Section: Discussionmentioning

confidence: 99%

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Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections

Zarmai

Ekere

Oduoza

et al. 2017

Robotics and Computer-Integrated Manufacturing

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The soldering process of interconnecting crystalline silicon solar cells to form photovoltaic (PV) module is a key manufacturing process. However, during the soldering process, stress is induced in the solar cell solder joints and remains in the joint as residual stress after soldering. Furthermore, during the module service life time, thermo-mechanical degradation of the solder joints occurs due to thermal cycling of the joints which induce stress, creep strain and strain energy. The resultant effect of damage on the solder joint is premature failure, hence shortened fatigue life. This study seeks to determine accumulated thermo-mechanical damage and fatigue life of solder interconnection in solar cell assembly under thermo-mechanical cycling conditions. In this investigation, finite element modelling (FEM) and simulations are carried out in order to determine nonlinear degradation of SnAgCu solder joints. The degradation of the solder material is simulated using Garofalo-Arrhenius creep model. A three dimensional (3D) geometric model is subjected to six accelerated thermal cycles (ATCs) utilising IEC 61215 standard for photovoltaic panels. The results demonstrate that induced stress, strain and strain energy impacts the solder joints during operations. Furthermore, the larger the accumulated creep strain and creep strain energy in the joints, the shorter the fatigue life. This indicates that creep strain and creep strain energy in the solder joints significantly impacts the thermo-mechanical reliability of the assembly joints. Regions of solder joint with critical stress, strain and strain energy values including their distribution are determined. Analysis of results demonstrates that creep energy density is a better parameter than creep strain in predicting interconnection fatigue life. The use of six ATCs yields significant data which enable better understanding of the response of the solder joints to the induced loads. Moreover, information obtained from this study can be used for improved design and better-quality fabrication of solder interconnections in solar cell assembly for enhanced thermo-mechanical reliability

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Section: Discussionmentioning

confidence: 70%

Section: Discussionmentioning

confidence: 99%

Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections

Zarmai

Ekere

Oduoza

et al. 2017

Robotics and Computer-Integrated Manufacturing

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“…The cycle time used in this study was 86,400 s (24 h or 1 day). Additionally, Guyenot et al (2011) reported that, within a temperature change of about 50°C, PV modules generally experience one and a half (1.5) thermal cycles per day. Thus, the expected life of interconnects (in years) is evaluated as: …”

Section: Resultsmentioning

confidence: 99%

Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana

Nyarko

Takyi

2021

SSMT

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Purpose A numerical study on the reliability of soldered interconnects of c-Si solar photovoltaic cells has been conducted. Design/methodology/approach A three-year data (2012–2014) from outdoor weathering of PV modules was used to generate temperature cycle profiles to serve as thermal loads and boundary conditions for the investigation of the thermo-mechanical response of the soldered interconnects when subjected to real outdoor conditions using finite element analysis (FEA) Software (Ansys. 18.2). Two types of soldered interconnections, namely, Sn60Pb40 and Sn3.8Ag0.7Cu (Pb-free), were modelled in this study. Findings Life prediction results from accumulated creep energy density damage show that the solder interconnects will achieve maximum life under the 2014 thermal cycle loading. In particular, the Sn60Pb40 solder interconnection is expected to achieve 14,153 cycles (25.85 years) whilst the Pb-free solder interconnection is expected to achieve 9,249 cycles (16.89 years). Additionally, under the test region average (TRA) thermal cycle, the Pb-free and Pb-Sn solder interconnections are expected to achieve 7,944 cycles (13.69 years) and 12,814 cycles (23.4 years), respectively. The study shows that Sn60Pb40 solder interconnections are likely to exhibit superior reliability over the Pb-free solder interconnections at the test site. Practical implications This study would be useful to electronics manufacturing industry in the search for a suitable alternative to SnPb solders and also the thermo-mechanical reliability research community and manufacturers in the design of robust PV modules. Originality/value The study has provided TRA data/results which could be used to represent the test region instead of a particular year. The study also indicates that more than six thermal cycles are required before any meaningful conclusions can be drawn. Finally, the life of the two types of solders (SnPb and Pb-free) as interconnecting materials for c-Si PV have been predicted for the test region (Kumasi in sub-Saharan Africa).

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“…Besides, since a numerical analysis does not create data variations, then n = 1. Hence, the equation of the signal-to-noise ratio transforms to: S/N = -10 log (∆ωacc) 2 (5)…”

Section: Doe Using Taguchi Methodsmentioning

confidence: 99%

“…Moreover, crystalline silicon PV modules are expected to last up to 25 years in field operations. Guyenot et al [2] estimated that for 1.5 thermal cycles per day with a temperature change of about 50 o C, expected life of solder joints for 25 years is 13688 cycles to failure.…”

Section: Introductionmentioning

confidence: 99%

Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly

Zarmai

Ekere

Oduoza

et al. 2016

Microelectronics Reliability

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A robust solder joint in crystalline silicon solar cell assembly is necessary to ensure its thermo-mechanical reliability. The solder joint formed using optimal parameter setting accumulates minimal creep strain energy density which leads to longer fatigue life. In this study, thermo-mechanical reliability of solder joint in crystalline silicon solar cell assembly is evaluated using finite element modelling (FEM) and Taguchi method. Geometric models of the crystalline silicon solar cell assembly are built and subjected to accelerated thermal cycling utilizing IEC 61215 standard for photovoltaic panels. In order to obtain the model with minimum accumulated creep strain energy density, the L 9 (3 3) orthogonal array was applied to Taguchi design of experiments (DOE) to investigate the effects of IMC thickness (IMC T), solder joint width (SJ W) and solder joint thickness (SJ T) on the thermo-mechanical reliability of solder joints. The solder material used in this study is Sn3.8Ag0.7Cu and its non-linear creep deformation is simulated using Garofalo-Arrhenius creep model. The results obtained indicate that solder joint thickness has the most significant effect on the thermomechanical reliability of solder joints. Analysis of results selected towards thermomechanical reliability improvement shows the design with optimal parameter setting to be: solder joint thickness-20µm, solder joint width-1000µm, and IMC thickness-2.5µm. Furthermore, the optimized model has the least damage in the solder joint and shows a reduction of 47.96% in accumulated creep strain energy density per cycle compared to the worst case original model. Moreover, the optimized model has 16264 cycles to failure compared with the expected 13688 cycles to failure of a PV module designed to last for 25 years.

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Enhancing the lifetime prediction methodology for photovoltaic modules based on electronic packaging experience

Cited by 7 publications

References 2 publications

Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections

Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections

Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana

Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly

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