Enhancing the tensile properties of Sn-Zn-Ag lead-free solder alloy by loading MgO nanoparticles and irradiation

Abstract

Lead-free composite solders has attracted more attention as they are required in the microelectronics industry to assure good electrical connections and the best mechanical response between integrated circuit devices and the substrate. The mechanical mixing technique was used to prepare the plain (Sn-5.3 wt% Zn-1 wt% Ag, SZA531) and composite solder (SZA531/0.5 wt% MgO), while MgO nanoparticles were synthesized by sol-gel technique. The aim to investigate the effects of loading 0.5 wt% MgO NPs and [Formula: see text]-irradiation doses (0–2.0 MGy) on the tensile properties of plain solder at different strain rates (ε•). The microstructural properties revealed that MgO was pure, crystalline, and had a nanoparticle-like morphology with an average crystallite size of 9.61 nm. Plain and composite solders contained β-Sn, Zn, and Ag, as well as some intermetallic compounds, Ag3Sn and AgZn. Loading MgO refined [Formula: see text]-Sn and Ag3Sn, while AgZn particles were partially dissolved. The thermal analysis reported that the melting point slightly increased from 206.1°C with SZA531 to 208.7°C when loaded which confirms the good solderability of composite solder. The tensile properties revealed that ultimate tensile strength and the tensile toughness increased with increasing ε•, dose of γ-rays, and MgO loading, while ductility decreased. The strain rate sensitivity index ( m) decrease with increasing the dose and MgO loading because of the decrease in the resistance to necking. These results were interpreted based on Orowan strengthening and dislocation strengthening.

Enhancing the microstructural, optical, and tensile properties of the PVC‐PMMA blend film: The role of PbO nanoparticles incorporation

“…The tensile characteristics of prepared films were investigated by recording the stress–strain curves utilizing a computerized, locally‐made tensile testing machine 23–25 . The films were separated into sections (pieces) that were sized like dumbbells that have 30 × 5 × ~0.20 mm dimensions.…”

“…The tensile characteristics of prepared films were investigated by recording the stress-strain curves utilizing a computerized, locally-made tensile testing machine. [23][24][25] The films were separated into sections (pieces) that were sized like dumbbells that have 30 Â 5 Â $0.20 mm dimensions. The films were stretched in only one dimension (uniaxially) until failure occurred at a constant crosshead speed of 0.5 mm/s.…”

Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag3Sn Phase

“…The strain rate sensitivity index decreased with higher doses and MgO loading due to reduced necking resistance, explained by Orowan and dislocation strengthening mechanisms. [ 18 ] Another study examined how adding SiC NPs affected the microstructure, thermal, and tensile properties of Sn–Zn–Ag solder alloy. Tensile tests showed that stress–strain curves varied with deformation temperature, strain rate, and SiC loading.…”