Enhancing yield and productivity with process control applications for contact and via module

Majoni, Stefan; Englard, Ilan

doi:10.1117/12.485025

Cited by 1 publication

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“…This capability can be used for SPC monitoring of CH ellipticity. As CH ellipticity and orientation change across the FEM, its value can be used in conjunction to CD and profile grade (PG) (i.e close/open sensitivity indicator) values [3], to establish or redefine the CPW limits and therefore be useful for scanner qualification and enhancing FAB productivity [3].…”

Section: Discussionmentioning

confidence: 99%

MacroCD contact ellipticity measurement for lithography tool qualification

Englard¹,

Setten

Janssen

et al. 2007

SPIE Proceedings

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Contact hole integrity is an important metric for IC manufacturers, which is reflected in tight ellipticity control as part of the lithography tool qualifications. The current ellipticity measurement methodology is very sensitive to random process variations of the contact hole shape. Determining ellipticity in a systematic manner poses a challenge on qualification productivity, as acquiring more data for statistical validity leads to unacceptably long measurement times. The introduction of the so-called MacroCD Vector measurement enables a single shot large sampling of contact holes, including vector calculation and averaging of all individual contact ellipticity results within the MacroCD measurement array. Based on these enhanced measurement features, it is shown that contact hole ellipticity can be determined with much higher accuracy while local, mostly process induced variations can be characterized simultaneously. This opens possibilities to study correlation between ellipticity and possible root causes in the litho process module.

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Section: Discussionmentioning

confidence: 99%