1996
DOI: 10.5006/1.3292122
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Environment-Induced Deformation Localization During Transgranular Stress Corrosion Cracking

Abstract: The nucleation and evolution of deformation patterns occurring during transgranular stress corrosion cracking (TGSCC) were studied in an attempt to produce new alternatives for addressing the nature of the embrittlement process. Flat, tensile α-brass (72% Cu-28% Zn) specimens were tested in 5 M aqueous ammonia (NH 4 OH) solution at a strain rate of 1 x 10 -5 /s. Slip-band spacing (SBS) and slip-band height (SBH) were measured as a function of strain by conducting interrupted experiments in the SCC environment … Show more

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Cited by 33 publications
(14 citation statements)
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“…It has been shown that enhanced corrosion takes place at emergent slip bands, but corrosion alone cannot account for the crack initiation or propagation. The dissolution rates calculated for the present system were by almost two orders of magnitude lower than the experimentally observed initiation rate of 0.1 #m/s [ 12,13].…”
Section: Environment-induced Deformation Localizationmentioning
confidence: 99%
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“…It has been shown that enhanced corrosion takes place at emergent slip bands, but corrosion alone cannot account for the crack initiation or propagation. The dissolution rates calculated for the present system were by almost two orders of magnitude lower than the experimentally observed initiation rate of 0.1 #m/s [ 12,13].…”
Section: Environment-induced Deformation Localizationmentioning
confidence: 99%
“…Similarly to the T-SCC causing electrolyte, the presence of hydrogen has been found to ease dislocation motion causing strain localization. In a recent study [12,13], we attributed the evolved enhanced dislocation activity to an environment-induced deformation localization mechanism. It was suggested that corrosion causes dislocation generation and injection from the surface at loads well below those required for normal yielding through a vacancy-dislocation interaction process.…”
Section: Stress-environment Interactionmentioning
confidence: 99%
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“…Regarding a substance of the interaction, some models explaining the localized plastic deformation promoted by anodic dissolution have been proposed primarily from the viewpoint of TG-SCC in fcc alloys. Among those, EIDEL(Environment-induced deformation localization) mechanism introduced by Meletis et al 9) seems available to the present SCC. Namely, based originally on the AVG (Anodic vacancy generation) model by Uhlig et al, 18) the mechanism is principally grounded on the enhanced dislocation mobility, accompanied by the following repeated processes at the surface layer; anodic dissolution-vacancy generation-dislocation nucleation-formation of planar dislocation arrangement-{111} micro-cracking-anodic dissolution.…”
Section: )mentioning
confidence: 99%
“…SCC mechanisms have been conventionally debated through classifying into two categories of anodic dissolution (AD) and hydrogen effects, but experimental results and new models presented [7][8][9][10] in recent years indicate that the above discussion is not sufficient; they demand that SCC process should be understood as the interactions under applied stress between AD and plastic deformation (dislocation mobility) 8,9) or among AD, plastic deformation and hydrogen effects. 10) Regarding HE also, in spite of quite many systems of materials and environments studied and a variety of mechanisms proposed, incomplete understanding is still obtained.…”
Section: Introductionmentioning
confidence: 99%