1993
DOI: 10.1088/0268-1242/8/6/021
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Epitaxial lift-off and its applications

Abstract: In this paper we will give an overview of the epitaxial lift-off (ELO) technique and its applications. The first part will describe the basic technology, which includes chemical lift-off, handling, bonding, stress, alignment, etc. The second part will give an overview of device results obtained with ELO (LEO and lasers on Si, MESFETS on InP, OEICS, etc).

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Cited by 92 publications
(45 citation statements)
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“…A promising set of prospects are trinary AlGaAs layers grown on GaAs substrates and then attached to silica or silicon mirrors via epitaxial liftoff (ELO) (Demeester et al, 1993). These structures have been grown on GaAs substrates and the resulting mechanical Q is $30 times larger than the best amorphous high-reflectivity coatings (Cole et al, 2008).…”
Section: Heteroepitaxial Bragg Mirrorsmentioning
confidence: 99%
“…A promising set of prospects are trinary AlGaAs layers grown on GaAs substrates and then attached to silica or silicon mirrors via epitaxial liftoff (ELO) (Demeester et al, 1993). These structures have been grown on GaAs substrates and the resulting mechanical Q is $30 times larger than the best amorphous high-reflectivity coatings (Cole et al, 2008).…”
Section: Heteroepitaxial Bragg Mirrorsmentioning
confidence: 99%
“…While recordhigh IQEs have been reported for devices fabricated on GaAs, 2 fabricating efficient LEDs typically requires lifting off 12,13 the GaAs substrate. On the other hand, the InGaAsP material system readily allows the fabrication of a thick lattice matched DHJ structure on a transparent InP substrate.…”
Section: Yield and Leakage Currents Of Large Area Lattice Matched Inpmentioning
confidence: 99%
“…As In could become scarce due to its present use in electronics [275] , the use of bulk material appears too expensive for applications. Therefore, homoepitaxial thin fi lms have been prepared on InP wafers which can be removed by established lift -off techniques [276] . The preparation by MOVPE allows scaling up and fi ne tuning of the growth process, enabling fabrication of fi lms with high electronic quality [277] .…”
Section: Basic Considerationsmentioning
confidence: 99%