Proceedings of the 2016 on International Symposium on Physical Design 2016
DOI: 10.1145/2872334.2872361
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ePlace-3D

Abstract: We propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform smoothness (2) 3D numerical solution with improved spectral formulation (3) 3D nonlinear pre-conditioner for convergence acceleration (4) interleaved 2D-3D placement for efficiency enhancement. Our placer outperforms the leading work mPL6-3D and NTUplace3-3D with 6.44% and 37.… Show more

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Cited by 36 publications
(2 citation statements)
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“…Moreover, proposed a novel relaxed conflict-net (RCN) graph based layer assignment method to refine the 3D placements 14 . Uses an electrostatics based 3D density function ensuring global smoothness with 3D numerical solution based on fast Fourier transform (FFT) and improved spectral formulation 12 . A nonlinear 3D pre-conditioner is introduced in 12 to equalise all the moving objects in the optimisation perspective and to enhance efficiency, interleaving coarse-grained 3D placement with fine grained 2D placement is used.…”
Section: Related Work and Motivational Backgroundmentioning
confidence: 99%
See 1 more Smart Citation
“…Moreover, proposed a novel relaxed conflict-net (RCN) graph based layer assignment method to refine the 3D placements 14 . Uses an electrostatics based 3D density function ensuring global smoothness with 3D numerical solution based on fast Fourier transform (FFT) and improved spectral formulation 12 . A nonlinear 3D pre-conditioner is introduced in 12 to equalise all the moving objects in the optimisation perspective and to enhance efficiency, interleaving coarse-grained 3D placement with fine grained 2D placement is used.…”
Section: Related Work and Motivational Backgroundmentioning
confidence: 99%
“…Currently, two type of 3D-IC placement techniques are popular, namely, folding based and partitioning based methods. Folding based method 6 use the 2D-IC placement layout and produce 3D layout by folding with local refinement and Partitioning based approaches [7][8][9][10][11][12] by minimising the usage of TSVs. Although, these tools are succeeded in 3D placement, still suffer from initial overlaps on the layer and complex partitioning for the TSVs resulting in increased design time and a large TSV count.…”
Section: Introductionmentioning
confidence: 99%