Epoxy composites filled with boron nitride and aluminum nitride for improved thermal conductivity

Hutchinson, John M.; Román, Frida; Cortés, P.; Calventus, Yolanda

doi:10.14314/polimery.2017.560

Cited by 15 publications

(34 citation statements)

References 2 publications

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“…This filler content of 47 wt.% was the limiting amount for the 2 µm platelets, but higher contents were achieved for the larger particles, with the thermal conductivity reaching a value of 4.22 W/mK at 58 wt.% filler content; this value can also be seen in Figure 9 to be approaching the intermediate trend line. The same effect of particle size was reported also by this group for agglomerates: for example, at 47 wt.% filler content, the thermal conductivity for composites made with lightly agglomerated 6 µm particles was 2.31 W/mK [63], whereas a significantly higher value of 3.40 W/mK was measured when 80 µm agglomerates were used [64]. It is interesting to note that with the use of hybrids, in which BN particles of different sizes are incorporated simultaneously, in particular 80/6 µm and 80/2 µm [64], the thermal conductivity did not increase for a given filler content, but decreased.…”

Section: Effect Of Bn Particle Size and Shapesupporting

confidence: 82%

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Hutchinson

Moradi

2020

Materials

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Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.

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Section: Effect Of Bn Particle Size and Shapesupporting

confidence: 82%

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Hutchinson

Moradi

2020

Materials

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“…The exothermic peak temperatures ( T p ) and the enthalpies of curing reactions (▵ H ) are presented in Table . T p value displays an obvious decrease from Sample I to V, which implies that the curing rate increases with increasing TiO 2 content . ▵ H is representative of the heat released in curing reaction, and the large difference among ▵H values is related to various TiO 2 amounts.…”

Section: Resultsmentioning

confidence: 92%

The Effects of Concentration and Particle Size of TiO₂ on the Dielectric Properties of Polyolefin‐Based Microwave Substrates

Wang

Mao

et al. 2020

ChemistrySelect

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Fibre-reinforced polybutadiene/ styrene-butadiene-styrene triblock copolymer/ ethylene-propylene-diene terpolymer/titanium dioxide (PB/SBS/EPDM/TiO 2 ) composite laminates with superior dielectric properties were fabricated by impregnation and hot pressing. The effects of concentration and particle size of rutile spherical TiO 2 on the microwave dielectric properties of the PB/SBS/EPDM/TiO 2 composite laminates were investigated at microwave frequency region. Additionally, the mechanical, thermal, and water absorption properties of the laminates were also evaluated. Results indicated that the dielectric properties were obviously improved with the increase of concentration or the decrease of particle size. The laminate filled with 230 nm TiO 2 at a filler loading of 70 wt% possessed high dielectric constant (7.03, 10 GHz), low dielectric loss (0.0042, 10 GHz), outstanding mechanical, thermal properties, and low water absorption. Enhanced dielectric properties and other prominent properties enable the fibre-reinforced polyolefin-based composite laminates to be a potential candidate for microwave substrate applications.

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“…In addition, although the BN particles are inert and hence would not a priori be expected to influence the chemical cure reaction, we have observed earlier that, for this epoxy-thiol system, there are some systematic effects of BN content on the reaction kinetics [21,29,30]. These effects were correlated to some extent with the thermal conductivity measurements, suggesting that the matrix-filler interface, so crucial to the thermal conductivity and dependent on SSA and filler particle shape and/or size, plays an important role also in the cure kinetics.…”

Section: Introductionmentioning

confidence: 88%

Epoxy composites filled with boron nitride: cure kinetics and the effect of particle shape on the thermal conductivity

Moradi

Calventus

Román

et al. 2020

J Therm Anal Calorim

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Thermally conducting and electrically insulating materials have been prepared by filling an epoxy-thiol system with boron nitride (BN) particles of different shapes (platelets and agglomerates) and sizes (from 2 to 180 μm), and hence with different specific surface areas. The cure kinetics has been studied by differential scanning calorimetry in both non-isothermal and isothermal modes, and it has been shown that there is a systematic dependence of the cure kinetics on the BN content, the cure reaction generally being retarded by the addition of the BN particles. For filler loadings greater than about 30 vol%, the retardation of the cure, in both isothermal and non-isothermal mode, appears also to decrease as the specific surface area decreases. For the smallest (2 μm) platelets, which have a significantly higher specific surface area (10 m 2 g −1), the retardation is particularly pronounced, and this aspect is rationalized in terms of the activation energy and frequency factor of the reaction. The thermal conductivity of the cured epoxy-thiol-BN composites has been measured using the transient hot bridge method and is found to increase in the usual way with increasing BN content for all the particle types and sizes. For the platelets, the thermal conductivity increases with increasing particle size, mirroring the effect of BN content on the cure kinetics. The agglomerates, though, give the highest values of thermal conductivity, contrary to what might be expected in the light of their specific surface areas. Scanning electron microscopy of the fracture surfaces of the cured composites has been used to show that the interface between epoxy matrix and filler particles is better for the agglomerates. This, together with the reduced interfacial area, explains their higher thermal conductivity.

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Epoxy composites filled with boron nitride and aluminum nitride for improved thermal conductivity

Cited by 15 publications

References 2 publications

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

The Effects of Concentration and Particle Size of TiO₂ on the Dielectric Properties of Polyolefin‐Based Microwave Substrates

Epoxy composites filled with boron nitride: cure kinetics and the effect of particle shape on the thermal conductivity

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Epoxy composites filled with boron nitride and aluminum nitride for improved thermal conductivity

Cited by 15 publications

References 2 publications

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

The Effects of Concentration and Particle Size of TiO2 on the Dielectric Properties of Polyolefin‐Based Microwave Substrates

Epoxy composites filled with boron nitride: cure kinetics and the effect of particle shape on the thermal conductivity

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The Effects of Concentration and Particle Size of TiO₂ on the Dielectric Properties of Polyolefin‐Based Microwave Substrates