Epoxy thermoset resins with high pristine thermal conductivity

Lin, Ying; Huang, Xingyi; Jin, Chen; Jiang, Pingkai

doi:10.1049/hve.2017.0120

Cited by 81 publications

(46 citation statements)

References 51 publications

(83 reference statements)

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“…A lot of research on space charge suppression by nano-fillers has been carried out [6,7,8,9,10]. And a large number of studies have shown that doping high thermal conductivity fillers can improve thermal conductivity [11,12,13,14]. Most of the research on thermal conductivity focuses on nano-modification of epoxy resins and other polymers.…”

Section: Introductionmentioning

confidence: 99%

Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper

et al. 2019

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Epoxy resin-impregnated insulation paper (RIP) composites are used as the inner insulation of dry condenser bushing in the ultra-high voltage direct current (UHVDC) power transmission system. To improve the dielectric properties and heat conductivity of RIP, hexagonal boron nitride (h-BN) nano-flakes are added to the insulation paper at concentrations of 0–50 wt % before impregnation with pure epoxy resin. X-ray diffraction (XRD), scanning electron microscopy (SEM) observations, thermal conductivity as well as the typical dielectric properties of direct current (DC) volume conductivity. DC breakdown strength and space charge characteristics were obtained. The maximum of nano-h-BN modified heat conductivity reach 0.478 W/(m·K), increased by 139% compared with unmodified RIP. The DC breakdown electric field strength of the nano-h-BN modified RIP does not reduce much. The conductivity of nano-h-BN modified is less sensitive to temperature. As well, the space charge is suppressed when the content is 50 wt %. Therefore, the nano-h-BN modified RIP is potentially useful in practical dry DC bushing application.

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Section: Introductionmentioning

confidence: 99%

Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper

et al. 2019

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“…39 Significant effort has been devoted to enhancing the thermal conductivity of liquid-crystalline epoxy resins. [9][10][11][12][13]40 These systems are often composed of combinations of liquid-crystalline bisepoxides and common diamines that do not have liquid crystallinity (eg, 4,4′-methylenedianiline (MDA)).…”

Section: Bisepoxide/diamine Systemsmentioning

confidence: 99%

Thermosets containing benzoxazole units: Liquid‐crystalline behavior and thermal conductivity

Hasegawa

Shigeta

Ishii

2018

Polymers for Advanced Techs

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A series of liquid‐crystalline (LC) thermosetting monomers containing benzoxazole (BO) units were synthesized to evaluate the thermal conductivities (λ) of their cured resins. A BO‐containing bisnadiimide system showed LC behavior during the heating process. However, the thermal cure of the bisnadiimide provided a film without optical anisotropy; consequently, the cured film exhibited normal levels of thermal diffusivity (α) and thermal conductivity (λ). The disappearance of the optically anisotropic ordered structures during thermal curing is likely related to the temperature gaps between the cure reaction ranges and LC ranges (Tcure‐TLC gap). In addition, epoxy resins consisting of bisepoxides and BO‐containing diamines were investigated because of their high flexibility in terms of molecular design that can be used to reduce the Tcure‐TLC gap. The combination of a terephthalylidene‐type bisepoxide and BO‐containing diamine with a controlled flexible chain length resulted in the smallest Tcure‐TLC gap among the epoxy resin systems examined herein. The cured epoxy resin film exhibited an appreciably increased λ value (0.257 W m−1 K−1) in the Z direction. This indicated the importance of the Tcure‐TLC gap for enhancing the α and λ values of the cured films. This epoxy resin system was cured under a continuous DC electric field during polarizing optical microscopy. A prompt response with deformation of the LC domains was observed in harmony with temporal ON/OFF switching of the DC power supply. As expected, the cured film exhibited a significantly enhanced λ value (0.488 W m−1 K−1) in the Z direction.

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“…At the same time, the insulation material in the equipments work for a long time and the insulation performance could be weakened. [1,2,3] As a result, more attention has been paid to thermal management, which becomes a key issue in many fields. Therefore, the research into the preparation and performance of materials for electrical insulation with high thermal management capabilities is important.…”

Section: Introductionmentioning

confidence: 99%

“…However, most traditional epoxy thermosetting resin materials are amorphous polymers with low thermal conductivity (usually in the range of 0.17-0.21 W/ (mÁK)), which cannot meet the high-power thermal management requirements in a small space. [1,7,8] Adding fillers with high thermal conductivity is an effective way to improve the thermal conductivity of epoxy resin currently, including carbon nanotubes (CNT), graphite, [8][9]10,11] ceramic oxide (Al 2 O 3 , SiO 2 ) [12] and nitride (AlN, BN). [13][14]15,16] Among these materials, Hexagonal BN has been the preferred material used in thermal management applications because of low density, various forms, high mechanical strength, good thermal conductivity (320 W/ (mÁK)) and chemical stability, and inherent electrical insulation.…”

Section: Introductionmentioning

confidence: 99%

Improved thermal and electrical properties of epoxy resin composites by dopamine and silane coupling agent modified hexagonal BN

et al. 2020

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The high thermal conductivity epoxy resin composites filled with inorganic filler can improve the low thermal conductivity of epoxy resin. However, a large number of fillers with high thermal conductivity will reduce other properties of the composites, which limits their use under high voltage, high temperature and strong mechanical force during operation. In this study, the dopamine-modified BN (DBN) and k-DBN (DBN modified by coupling agent KH-560) were prepared by employed the dopamine with catechol groups and coupling agent to modify boron nitride. The thermal conductivity, thermal stability, and dielectric properties of composites with different contents of modified fillers were studied. The results showed that surface modification improved the dispersibility of BN in the resin matrix and compatibility with the resin. Among BN/EP, DBN/EP, k-DBN/EP composites, k-DBN/EP composites had the highest thermal conductivity at the same number of additions. When the k-DBN/EP content was 30 wt%, the thermal conductivity of the composite was 0.892 W/(mÁK), which was an increase of 25.5% compared with the BN/EP composite. The appropriate amount of BN filling (20 wt%) can improve the breakdown strength of the composite material.

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Epoxy thermoset resins with high pristine thermal conductivity

Cited by 81 publications

References 51 publications

Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper

Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper

Thermosets containing benzoxazole units: Liquid‐crystalline behavior and thermal conductivity

Improved thermal and electrical properties of epoxy resin composites by dopamine and silane coupling agent modified hexagonal BN

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