1990
DOI: 10.1007/bf01447199
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EPR investigation of plasma-chemical resist etching in O2 and O2/CF4 discharges

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Cited by 20 publications
(10 citation statements)
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“…With increasing CF 4 content, large numbers of active fluorine‐containing species are generated, etching rate is increased, [ 22 ] and nano‐scale grooves was enlarged, [ 23,24 ] which resulting in higher roughness. [ 25‐27 ]…”
Section: Resultsmentioning
confidence: 99%
“…With increasing CF 4 content, large numbers of active fluorine‐containing species are generated, etching rate is increased, [ 22 ] and nano‐scale grooves was enlarged, [ 23,24 ] which resulting in higher roughness. [ 25‐27 ]…”
Section: Resultsmentioning
confidence: 99%
“…Cross linked PEG low-pressure glow plasma to coat the inner surface of soft tubular structures due to the pressure differences between the tube inside and outside which will distort the walls (d 'Agostino 1990;Ratner 1992;Yasuda 1985;Occhiello et al 1991;Suzuki et al 1986;Griesser et al 1994). The APGD system is useful in modifying materials by way of surface treatment, deposition, and surface etching similar to low pressure glow plasmas (Suwa et al 1996;Breitbarth et al 1990) even for inside of the fine tube. We report the application of APGD to fluorinate the inner surface of commercial poly(vinyl chloride) (PVC) tubes to enhance biocompatibility for a blood circulating tube.…”
Section: Binding Energy / Evmentioning
confidence: 99%
“…The oxygen atom mass flow was measured downstream using a titration technique [4][5][6]. This method is based on the following reactions:…”
Section: Titration Measurementsmentioning
confidence: 99%
“…As an independent method for measuring the oxygen atom mass flow we employed a titration technique [4][5][6]. We also used oxygen atom actinometry for monitoring ground state oxygen atoms in plasma.…”
Section: Introductionmentioning
confidence: 99%
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