Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298]

Ahmad, Mudasir; Hubbard, K.; Hu, Mason

doi:10.1115/1.2165648

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2012

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“…Solder bump joint reliability is known to be dependent on the shape of solder bumps after reflow. Bump shape was determined by the amount of solder volume and joint structure [11]. Liu et al fabricated solder bumps with the shape of hourglass type, cylinder type and barrel type [12].…”

Section: Introductionmentioning

confidence: 99%

Effect of Bump Shape on Current Density and Temperature Distributions in Solder Bump Joints under Electromigration

Zhao

Liu

et al. 2012

AMR

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Three dimensional thermo-electrical finite element analysis was employed to simulate the current density and temperature distributions for solder bump joints with different bump shapes. Mean-time-to-failure (MTTF) of electromigration was discussed. It was found that as the bump volume increased from hourglass bump to barrel bump, the maximum current density increased but the maximum temperature decreased. Hourglass bump with waist radius of 240 μm has the longest MTTF.

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Section: Introductionmentioning

confidence: 99%