1967
DOI: 10.1007/bf00572423
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Etching studies of beryllium oxide crystals

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1968
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Cited by 10 publications
(3 citation statements)
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“…However, the current of the MIM device with the BeO thin film sintered at 1500 °C gradually increased below the nA range due to the applied voltages under both positive and negative bias. The leakage currents were 49 pA and 95 pA at −20 V and + 20 V, respectively, while no breakdown voltage arose in the MIM device with the BeO thin film sintered at 1500 °C over the voltage sweeping range of −20 V to 20 V, indicating that the BeO Although the active channel was patterned with a shadow mask for the lateral structure of the MIM device, an additional process such as wet etching is also possible if the proper etchants are used [36]. Contrary to the smooth surface of the active region, numerous defects and pinholes can be observed in the OM images of the active region of the MIM device with BeO layers after sintering at 1100 • C and 1300 • C (Supplementary Figure S4).…”
Section: Figure 1amentioning
confidence: 99%
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“…However, the current of the MIM device with the BeO thin film sintered at 1500 °C gradually increased below the nA range due to the applied voltages under both positive and negative bias. The leakage currents were 49 pA and 95 pA at −20 V and + 20 V, respectively, while no breakdown voltage arose in the MIM device with the BeO thin film sintered at 1500 °C over the voltage sweeping range of −20 V to 20 V, indicating that the BeO Although the active channel was patterned with a shadow mask for the lateral structure of the MIM device, an additional process such as wet etching is also possible if the proper etchants are used [36]. Contrary to the smooth surface of the active region, numerous defects and pinholes can be observed in the OM images of the active region of the MIM device with BeO layers after sintering at 1100 • C and 1300 • C (Supplementary Figure S4).…”
Section: Figure 1amentioning
confidence: 99%
“…The OM image of the MIM device under the 1500 • C sintering condition and the I-V characteristics of the MIM device with BeO thin films created with different sintering temperatures are correspondingly shown in Figure 7a,b. In the OM image, the patterned active channel distances between the lateral electrodes are 150 µm, and the width is 385 µm.Although the active channel was patterned with a shadow mask for the lateral structure of the MIM device, an additional process such as wet etching is also possible if the proper etchants are used[36]. Contrary to the smooth surface of the active region, numerous defects and pinholes can be observed in the OM images of the active region of the MIM device with BeO layers after sintering at 1100 • C and 1300 • C (Supplementary FigureS4).…”
mentioning
confidence: 99%
“…It was cut on a diamond saw to have the orientation indicated in Fig.2. The crystal was etched in Li2MoO4-NaPO3 at .-~ 1000 °C to remove all surface damage due to the cutting operation (Austerman, Newkirk, Smith & Newkirk, 1967). This one crystal was used for all the experiments described here.…”
Section: Comparison Of Theory and Experimentsmentioning
confidence: 99%