MEMS Wet-Etch Processes and Procedures

Burns, D.W.

doi:10.1007/978-0-387-47318-5_8

Cited by 6 publications

(10 citation statements)

References 404 publications

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“…The process of wet etching is relatively simple [30,38,39]. Firstly, the substrate is patterned with an etch mask.…”

Section: Wet Etchingmentioning

confidence: 99%

“…Unlike in dry etching, there is little erosion of the mask during the process, and the thickness is often not critical. Usually, the substrate(s) to be etched are immersed directly in the etchant solution, but spray etching systems are also common [30,38]. The temperature and agitation of the etchant solution must be carefully controlled as the etch rate may depend on these parameters.…”

Section: Wet Etchingmentioning

confidence: 99%

“…Excessive undercut is often due to the mask becoming partially detached from the underlying film resulting in enhanced lateral etching [30]. Such peeling back of the mask may arise due to poor adhesion of the mask to the film and/or high internal stress [30,38,39]. It should be noted that the adhesion of photoresist masks to gold is often quite poor as conventional adhesion promoters (e.g.…”

Section: Wet Etchingmentioning

confidence: 99%

“…A 1985 review by Norrman and Stripple [34] evaluated a number of gold etchants, and details on many others can be found in a number of standard compilations of etch recipes [11,38,39,[41][42][43].…”

Section: Wet Etchingmentioning

confidence: 99%

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Gold etching for microfabrication

2014

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The etching of gold is a key enabling technology in the fabrication of many microdevices and is widely used in the electronic, optoelectronic and microelectromechanical systems (MEMS) industries. In this review, we examine some of the available methods for patterning gold thin films using dry and wet etching techniques. Dry methods which utilise reactive ion etching (RIE) have a number of important advantages over other methods, but the low volatility of gold etch products has made the development of suitable processes problematic. More recently, the adoption of high-density plasma reactors with optimised chlorine-based chemistries has allowed improved processes to be developed, and etching in hydrogen plasmas also shows promise. Wet etching methods for gold have also been critically reviewed. Traditionally, iodine-and cyanide-based etch processes have been used, but in the last decade, a number of alternative etchants have been studied. Of particular interest is the recent development of a range of novel nonaqueous-based gold etchants, and the suitability of these etchants for microfabrication is assessed.

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“…The process of wet etching is relatively simple [30,38,39]. Firstly, the substrate is patterned with an etch mask.…”

Section: Wet Etchingmentioning

confidence: 99%

Section: Wet Etchingmentioning

confidence: 99%

Section: Wet Etchingmentioning

confidence: 99%

Section: Wet Etchingmentioning

confidence: 99%

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Gold etching for microfabrication

2014

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“…Acid piranha, for example, has been known as a photoresist stripper since at least 1975 [31], and its use is prevalent in the semiconductor industry. Standard operating procedure for acid piranha varies, but typical acid/peroxide ratios are in the range of 2∶1-7∶1 (two to seven parts 99% sulfuric acid to one part 30% hydrogen peroxide) and typical processing temperatures are in the range of 90°C-140°C [32,33]. Optimized piranha-cleaning processes for MLD gratings documented in the open literature have been consistent with these ranges [12][13][14].…”

Section: Acid Piranha Cleaning At Low Temperaturesmentioning

confidence: 90%

Improving the performance of high-laser-damage-threshold, multilayer dielectric pulse-compression gratings through low-temperature chemical cleaning

et al. 2013

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A low-temperature chemical cleaning approach has been developed to improve the performance of multilayer dielectric pulse-compressor gratings for use in the OMEGA EP laser system. X-ray photoelectron spectroscopy results guided the selection of targeted cleaning steps to strip specific families of manufacturing residues without damaging the grating's fragile 3D profile. Grating coupons that were cleaned using the optimized method consistently met OMEGA EP requirements on diffraction efficiency and 1054 nm laser-damage resistance at 10 ps. The disappearance of laser-conditioning effects for the highest-damage-threshold samples suggests a transition from a contamination-driven laser-damage mechanism to defect-driven damage for well-cleaned components.

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High‐performance MEMS shutter display with metal‐oxide thin‐film transistors and optimized MEMS element

et al. 2023

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Active matrix prestressed microelectromechanical shutter displays enable outstanding optical properties as well as robust operating performance. The microelectromechanical systems (MEMS) shutter elements have been optimized for higher light outcoupling efficiency with lower operation voltage and higher pixel density. The MEMS elements have been co‐fabricated with self‐aligned metal‐oxide thin‐film transistors (TFTs). Several optimizations were required to integrate MEMS process without hampering the performance of both elements. The optimized display process requires only seven photolithographic masks with ensuring proper compatibility between MEMS shutter and metal‐oxide TFT process.

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MEMS Wet-Etch Processes and Procedures

Cited by 6 publications

References 404 publications

Gold etching for microfabrication

Gold etching for microfabrication

Improving the performance of high-laser-damage-threshold, multilayer dielectric pulse-compression gratings through low-temperature chemical cleaning

High‐performance MEMS shutter display with metal‐oxide thin‐film transistors and optimized MEMS element

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