Evaluating and monitoring nucleation and growth in copper foil

Lee, Ye-Kun; O’Keefe, Thomas J.

doi:10.1007/bf02701655

Cited by 9 publications

(2 citation statements)

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“…The addition of Arabic gum and HEC increased the surface roughness of copper deposit compared to additive-free case. This effect is more profound with the addition of chlorine, which is consistent with previous results [2]. Another important result is that the addition of chlorine changed the dominant growth planes of the copper deposit from (111) to (220).…”

Section: Effect Of Additivessupporting

confidence: 92%

“…With an increasing trend in device miniaturization, in demand are void-free thin copper foils of less than 10 µm thick with a very low surface profile. Although various additives are widely practiced in copper foil industry, and numerous investigations were attempted to understand their beneficial mechanisms, the role of additives still remain unresolved [1,2]. Accordingly, in order to gain insight into the nucleation and growth kinetics of copper during electrodeposition, titanium cathodic substrates were moderated in conjunction with use of various additives such as Arabic gum, hydroxyl ethyl cellulose (HEC), and chlorine under constant current condition same as that used in the industries.…”

Section: Introductionmentioning

confidence: 99%

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The Effect of Additives and Substrate Conditions on the Copper Electrodeposition for Thin Film Applications

Woo

Seol

Park

et al. 2007

AMR

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The effect of surface states of substrate and additives on copper electrodeposition for thin film applications was investigated. Titanium substrate states were mechanically and chemically moderated and several additives such as Arabic gum, hydroxyl ethyl cellulose, and chlorine were used during electrodeposition process under a constant current condition with current density of 500 mA/cm2. Results obtained using SEM, X-ray, and AFM for early stage of copper nucleation and growth revealed that substrate conditions and additives appear to be effective in producing uniformly-distributed copper nuclei and their subsequent growth in a regulated manner of surface leveling. The shape of copper nuclei was clearly affected by the surface state of the substrate. It seems to be related with dislocations produced on the titanium cathode during surface moderating. Hardness, growth direction, and resistivity of copper deposits changed with the kind of additives.

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Section: Effect Of Additivessupporting

confidence: 92%

Section: Introductionmentioning

confidence: 99%