Mechanical properties and microstructure of rolled and electrodeposited thin copper foil

Yin, Xiang; Peng, Lijun; Kayani, Saif Haider; Cheng, Longdi; Wang, Jianwei; Xiao, Wei; Wang, Ligen; Huang, Guojie

doi:10.1007/s12598-016-0806-4

Cited by 27 publications

(7 citation statements)

References 20 publications

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“…Electrolytic Cu foil now dominates the anode CC market as the technology is relatively simple and easy to control the foil thickness. [ 17 ] This chapter introduces the process improvement measures for electrolytic Cu foil.…”

Section: Specific Approaches To Meet the Requirements Of CCmentioning

confidence: 99%

Significance of Current Collectors for High Performance Conventional Lithium‐Ion Batteries: A Review

Wang

Song

et al. 2023

Adv Funct Materials

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Conventional lithium‐ion batteries (LIBs) are constantly evolving to improve their electrochemical performance and safety. In the past decade, research on electrode and electrolyte materials has significantly promoted the development of conventional LIBs. However, the current collector (CC) in conventional LIBs has not received sufficient attention. As a transfer unit that collects and disperses electrons from electrodes and transports them to the load, the performance of the CC significantly affects the performance of LIBs. This article reviews the impact of the CC on the electrochemical performance and safety of conventional LIBs in four aspects: CC requirements, manufacturing process, surface coating modification, and multifunctionalized CCs. Meanwhile, this review provides an objective summary and prospect on the transition from single‐functionality to multifunctionality requirements for CC, as well as the future needs for CC development and the technical hurdles that should be overcome. The article focuses on providing a detailed insight into the important impact of CCs on conventional LIBs, which has not received enough attention in the past. It emphasizes the need and urgency for the development of multifunctional CCs to provide new ideas for improving the performance of conventional LIBs.

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Section: Specific Approaches To Meet the Requirements Of CCmentioning

confidence: 99%

Significance of Current Collectors for High Performance Conventional Lithium‐Ion Batteries: A Review

Wang

Song

et al. 2023

Adv Funct Materials

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“…Failure strength of materials, including copper foil, woven E-glass/epoxy, and woven carbon fiber/epoxy, are shown in Tab. 6 [Tan, Tong and Steven (2001); Qrimli, Mahdi and Ismail (2015); Yin, Peng, Kayani et al (2016)]. The maximum principal stress of E-glass/epoxy layer in the PCB with 2.6 mm thickness under the shock loading by the finite element analysis is 49.6 MPa and is smaller than its failure strength 587 MPa.…”

Section: The Pcb With Different Thickness Under Shock Loadingmentioning

confidence: 99%

“…The failure strength of copper foil, woven E-glass/epoxy, and woven carbon fiber/epoxy[Tan, Tong and Steven (2001);Qrimli, Mahdi and Ismail (2015);Yin, Peng, Kayani et al (2016)] …”

mentioning

confidence: 99%

Stress Analysis of Printed Circuit Board with Different Thickness and Composite Materials Under Shock Loading

Liu¹,

Lu²,

Tai³

et al. 2020

Computer Modeling in Engineering &Amp; Sciences

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In this study, the deformation and stress distribution of printed circuit board (PCB) with different thickness and composite materials under a shock loading were analyzed by the finite element analysis. The standard 8-layer PCB subjected to a shock loading 1500 g was evaluated first. Moreover, the finite element models of the PCB with different thickness by stacking various number of layers were discussed. In addition to changing thickness, the core material of PCB was replaced from woven E-glass/epoxy to woven carbon fiber/epoxy for structural enhancement. The non-linear material property of copper foil was considered in the analysis. The results indicated that a thicker PCB has lower stress in the copper foil in PCBs under the shock loading. The stress difference between the thicker PCB (2.6 mm) and thinner PCB (0.6 mm) is around 5%. Using woven carbon fiber/epoxy as core material could lower the stress of copper foil around 6.6% under the shock loading 1500 g for the PCB with 0.6 mm thickness. On the other hand, the stress level is under the failure strength of PCBs with carbon fiber/epoxy core layers and thickness 2.6 mm when the peak acceleration changes from 1500 g to 5000 g. This study could provide a reference for the design and proper applications of the PCB with different thickness and composite materials.

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“…Copper foil has emerged as a prominent metal material in recent years, finding widespread use in 5G communication and lithium-ion batteries due to its high surface quality, good balance of strength and flexibility, and small thickness (<12 μm). − Lithium-ion batteries are poised to dominate the future electronic consumer market as the most crucial energy storage device . The primary components of lithium-ion batteries encompass electrode materials, current collectors, electrolytes, and separators.…”

Section: Introductionmentioning

confidence: 99%

Gelatin Effects on the Kinetic of an Electrodeposition Process in Copper Foil Preparation

Li,

Chen,

Zhou

et al. 2024

J. Phys. Chem. C

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In the electrolysis of copper foil, the addition of trace additives can adjust the kinetic parameters of the copper electrochemical process to control the crystal orientation. This is of great significance for the production of ultrathin copper foil and its application in lithium-ion batteries. The reaction rate constant and diffusion coefficient determine the rate of the electrochemical and mass transfer processes around the electrode−electrolyte interface. In this study, the influences of gelatin on the kinetic parameters of copper electrodeposition were fully investigated. An electrochemical study found that gelatin could make the copper deposit more difficult to dissolve and that an increase in gelatin concentration would reduce the charge transfer rate of the Cu 2+ → Cu reaction. An RDE study found that the addition of gelatin reduced the reaction rate constant of the Cu 2+ → Cu reaction and increased the diffusion coefficient of Cu 2+ in the electrolyte. Increasing the gelatin concentration from 0.002 to 0.02 g/L was beneficial to the grain refinement of the deposited layer. After the addition of gelatin, the copper deposit layer grew preferentially on the (111) crystal plane.

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Mechanical properties and microstructure of rolled and electrodeposited thin copper foil

Cited by 27 publications

References 20 publications

Significance of Current Collectors for High Performance Conventional Lithium‐Ion Batteries: A Review

Significance of Current Collectors for High Performance Conventional Lithium‐Ion Batteries: A Review

Stress Analysis of Printed Circuit Board with Different Thickness and Composite Materials Under Shock Loading

Gelatin Effects on the Kinetic of an Electrodeposition Process in Copper Foil Preparation

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