2018
DOI: 10.1063/1.5036738
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Evaluating the impact of thermal annealing on c-Si/Al2O3 interface: Correlating electronic properties to infrared absorption

Abstract: Al2O3 is the standard for the passivation of p-type PERC (Passivated Emitter Rear Contact) solar cells. It is well established that the thin interfacial silicon oxide layer in between Al2O3 and c-Si plays a key role in its surface passivation mechanism. In this work, we investigate the interface properties of c-Si/Al2O3 by non-destructive methods. We show that Brewster angle Fourier transform infrared spectroscopy has a remarkable sensitivity to the interfacial silicon oxide layer by exploiting the large cross… Show more

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Cited by 11 publications
(5 citation statements)
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“…One can also notice that the shift of the C-V characteristic to the right, suggesting a decrease of positive charges or the introduction of extra negative charges. A similar shift was observed for Al 2 O 3 /Si under thermal treatment [44] and could be explained by the release of the hydroxyl group. Unfortunately, information regarding the composition and impurities of the films after annealing is not available.…”
Section: Resultssupporting
confidence: 79%
“…One can also notice that the shift of the C-V characteristic to the right, suggesting a decrease of positive charges or the introduction of extra negative charges. A similar shift was observed for Al 2 O 3 /Si under thermal treatment [44] and could be explained by the release of the hydroxyl group. Unfortunately, information regarding the composition and impurities of the films after annealing is not available.…”
Section: Resultssupporting
confidence: 79%
“…Small Si–O peaks centered at ∼103.3 eV were also observed as shown in Figure S2, which confirms the existence of an SiO X layer despite the fact that this interlayer was not visible at the c -Si­( p )/MoO X interface in the high-resolution transmission electron microscope (HRTEM) image in Figure a. The oxygen atoms in the SiO X likely originated from the O 3 exposure during the ALD process or from O migration from the MoO X layer at the interface.…”
Section: Results and Discussionsupporting
confidence: 56%
“…With extra annealing treatment, both ALD processes show lower D it ≤ 1×10 11 cm -2 [24][25] . Regarding the eld-effect passivation, the thermal ALD-based Al 2 O 3 lm exhibits especially low Q it of the order of 10 11 cm -2 before annealing comparing to plasma ALD with Q it of the order of 10 12 cm -2 .…”
Section: Resultsmentioning
confidence: 98%