2019 International Conference on Electronics Packaging (ICEP) 2019
DOI: 10.23919/icep.2019.8733457
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Evaluation and Benchmarking of Cu Pillar Micro-bumps with Printed Polymer Core

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Cited by 6 publications
(3 citation statements)
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“…Arrays of pillars [ 1 ] belong to a class of electro-mechanical multicomponent systems. This class involves devices that are important and frequently encountered in such areas of nanotechnology as bio-mechanical sensing [ 2 , 3 ], nanoscale electronics, thermoelectrics or photovoltaics, to name but a few [ 4 , 5 ]. Especially prominent applications of nanopillars refer to flexible sensors capable of detecting and measuring multidirectional forces [ 6 ] or high-performance piezoelectric nanogenerators that convert external mechanical energy into electricity [ 7 , 8 , 9 , 10 ].…”
Section: Introductionmentioning
confidence: 99%
“…Arrays of pillars [ 1 ] belong to a class of electro-mechanical multicomponent systems. This class involves devices that are important and frequently encountered in such areas of nanotechnology as bio-mechanical sensing [ 2 , 3 ], nanoscale electronics, thermoelectrics or photovoltaics, to name but a few [ 4 , 5 ]. Especially prominent applications of nanopillars refer to flexible sensors capable of detecting and measuring multidirectional forces [ 6 ] or high-performance piezoelectric nanogenerators that convert external mechanical energy into electricity [ 7 , 8 , 9 , 10 ].…”
Section: Introductionmentioning
confidence: 99%
“…Significant progress has been made in the creation and development of sub-micron-scale devices, including nanopillars assembled in an ordered fashion on flat substrates [ 1 , 2 ]. Nowadays, mezo-scale pillar arrays are applied in areas of nanotechnology such as bio-mechanical sensing [ 3 ], nanoscale electronics, photovoltaics or thermoelectrics, to name a few [ 4 , 5 , 6 ]. An interesting class of nanodevices includes high-performance piezoelectric nanogenerators (NG) that convert external mechanical energy into electricity [ 7 ].…”
Section: Introductionmentioning
confidence: 99%
“…However, the coefficient of thermal expansion (CTE) and dielectric properties of these intrinsic materials are mostly not satisfactory. The large relative permittivity and dielectric loss factor may cause signal delay and signal loss during the signal transmission in high-frequency printed circuit boards, and the large CTE may cause large internal stress and induce failure in the electronic packaging . To realize low permittivity (low k ), fluoro group, and other aliphatic group such as adamantane were introduced. Fang et al reported a novel fluoro-containing dendrimeric siloxane precusor with aryl-trifluorovinyl-ether (−OCFCF 2 ) as the cross-linkable group, which converted into a highly cross-linked thermoset showing low- k value as 2.40 and low water absorption .…”
Section: Introductionmentioning
confidence: 99%