Tin
monosulfide can
be grown in cubic (π-SnS) and orthorhombic
(α-SnS) polymorphs by low-temperature atomic layer deposition
(ALD). The optical properties of these polymorphs make them attractive
for the realization of plasmonic solar cells with ultrathin absorber
layers down to 10 nm in thickness. SnS is also an earth-abundant and
nontoxic compound semiconductor of high interest for regular thin-film
photovoltaics. To better understand the behavior of the two SnS polymorphs
in ultrathin solar cell configurations, we here fabricate, characterize,
and analyze a range of such devices. ALD is used to grow SnS and form
heterojunctions with zinc oxysulfide [Zn(O,S)], acting as a buffer
layer with a composition-tunable bandgap. Apart from the roles of
the SnS polymorph and Zn(O,S) composition, the effects of the back
contact material and thicknesses of buffer and absorber layers are
investigated. Devices using π-SnS and pure ZnO buffers yield
the highest photocurrents (3.1 mA/cm2) and higher open
circuit voltage (159 mV) than similar α-SnS-based devices. Analysis
of the equivalent-circuit parameters suggests that interface recombination
limits the voltage for these devices. While Zn(O,S) with a higher
sulfur content provides chemical passivation of the SnS interface
and excessive open circuit voltages above 600 mV, it also exhibits
a too high conduction band offset, which hampers current collection.
A growth delay during the ALD of Zn(O,S) on SnS initially amplifies
the known sulfur–oxygen exchange reaction, such that a sulfur-rich
Zn(O,S) region forms next to the SnS interface. This causes a thin
ZnS-like barrier to form already for low cycle fractions of the H2S precursor in the ALD super-cycle. Voltage and fill factor
trends suggest an optimal SnS absorber layer thickness in the range
of 15–35 nm, presenting an opportunity for plasmonic absorption
enhancement. Devices with π-SnS show most promise, but interface
recombination versus current-blocking is a dilemma for the SnS/Zn(O,S)
heterojunction.