Evaluation of Ag wire reliability on fine pitch wire bonding

Xi, Jiaqing; Mendoza, Norbe; Chen, Kevin; Yang, Thomas C.-K.; Reyes, Edward; Bezuk, Steve; Lin, Juln; Ke, Shenggin; Chen, Eason

doi:10.1109/ectc.2015.7159779

Cited by 15 publications

(9 citation statements)

References 2 publications

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“…The average value of ball shear was 16.678 gf (grams force) which meets the requirement of 8 gf for industrial applications of 15 μm gold wire. It is also much larger than that of copper wire of 20 μm in diameter (8.3 gf) [43] and Ag wire of 18 μm in diameter (14.31 gf) [44].…”

Section: Wire Bonding Strength Testmentioning

confidence: 89%

Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging

et al. 2020

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Section: Wire Bonding Strength Testmentioning

confidence: 89%

Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging

et al. 2020

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“…A concern is intermetallic 1 3 compound (IMC) formation at the bonding interface. The IMC layer has often been found to be the weak region due to its brittle nature, leading to a high failure rate of the bonding joints [14][15][16][17]. Several research studies have sought to understand the IMC formation and the resulting phases in Ag-Al wire bonds.…”

Section: Introductionmentioning

confidence: 99%

A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation

Lee

2017

J Mater Sci: Mater Electron

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In electronic packaging in recent years, silver (Ag) alloy wires have been widely adopted in wire-bond processes. The bond pads on the device chips are mostly aluminum (Al). Thus, the bonding interface is mainly Ag-Al. In recent Ag alloy wirebond publications, it is unclear what intermetallic phases form at the interface. In this research, experiments were designed to understand the Ag-Al intermetallic compound (IMC) formation in the Ag-Al system and evaluate its mechanical properties. First, the Ag-Al alloys with compositions from 19 to 43 at.% Al were evaluated to identify the phase equilibrium and crystal structure of the Ag-Al intermetallic phases. Microstructures and phase compositions of the designed Ag-Al alloys are presented. To further study the intermetallic compound formation at the Ag/Al interface, the interfacial reaction of the Ag/Al joints at 200 °C was investigated. The µ-Ag 3 Al and δ-Ag 2 Al IMC were identified to form at the Ag/Al interface and stabilize after long-time annealing at 200 °C. At last, deformation and fracture behaviors of the bulk µ-Ag 3 Al and δ-Ag 2 Al were analyzed by the micro-indentation. The measured results reveal that µ-Ag 3 Al exhibits significantly higher hardness and lower fracture toughness as compared to δ-Ag 2 Al. Indentation crack propagation in µ-Ag 3 Al demonstrates the fracture characteristics of brittle materials. In the case of δ-Ag 2 Al, the presence of slip bands exhibits the ductility of δ-Ag 2 Al to endure plastic deformation prior to fracture. The effect of the mechanical properties of the µ-Ag 3 Al and δ-Ag 2 Al IMC on the Ag-Al joint reliability is discussed. New information obtained in this research is important for future study of the joint reliability and failure mechanism of Ag-Al wire bonds.

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“…In choosing a wire material, one important thing to consider is how it bonds to the Al pads [12,13]. Several research works have shown that the bonding on the Ag-Al interface is caused by intermetallic compound (IMC) formation [14][15][16]. Based on the Ag-Al phase diagrams [17,18] and experiment results, the main IMCs are Abstract Typical epoxy molding compounds (EMC) contain chlorine ions that cause silver wire-bond failures under highly accelerated temperature/humidity stress test (HAST).…”

Section: Introductionmentioning

confidence: 99%

“…Ag 3 Al and Ag 2 Al [15][16][17][18]. Reliability of Ag alloy wirebonds has been evaluated under high temperature and high humidity test conditions [11,[13][14][15][16]. In high temperature storage test (HTS), Ag alloy wire-bonds pass industrial reliability standard [11,14,15].…”

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confidence: 99%

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A corrosion study of Ag–Al intermetallic compounds in chlorine-containing epoxy molding compounds

Lee

2017

J Mater Sci: Mater Electron

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Evaluation of Ag wire reliability on fine pitch wire bonding

Cited by 15 publications

References 2 publications

Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging

Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging

A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation

A corrosion study of Ag–Al intermetallic compounds in chlorine-containing epoxy molding compounds

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