Evaluation of contact resistance for isotropic electrically conductive adhesives

Gaynes, Michael; Lewis, Robert W.; Saraf, Ravi F.; Roldan, J.M.

doi:10.1109/96.386265

Cited by 67 publications

(24 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…1-3 A number of research articles about the electrical properties of metal-filled polymer composites have been reported. [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15] It was found that the interface between the metal fillers is one of the major factors that could degrade the electrical property of the polymer composite. 16,17 One of the approaches to minimize the interface is to make these fillers fuse with each other.…”

Section: Introductionmentioning

confidence: 99%

Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate

Dong

Moon

Wong

2004

Journal of Elec Materi

View full text Add to dashboard Cite

Molecular dynamics (MD) simulation was conducted to investigate the coalescence of Cu nanoparticles and their deposition on a Cu substrate at various temperatures from 400 K to 1,000 K using the embedded atom method (EAM). The x-z plane projection, spreading index, coalescence index, and pair-correlation distribution were analyzed to gain more insight into the sintering process. Simulation results showed that even at a low temperature of 400 K, metal spheres can be collapsed and deposited on the substrate. Yet higher temperatures were helpful in enhancing the degree of collapsing and deposition.

show abstract

Section: Introductionmentioning

confidence: 99%

Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate

Dong

Moon

Wong

2004

Journal of Elec Materi

View full text Add to dashboard Cite

show abstract

“…The ICAs satisfy the requirements for lead-free (green, environmentally friendly) interconnects, and their processing temperature is considerably lower (100-150°C ) than that of eutectic (220-230°C ) or lead-free solders, such as SnAg (96.5%/3.5% by weight, respectively) and SnAgCu (96.1%/3.2%/0.7% by weight, respectively). [1][2][3][4][5][6][7][8][9][10][11][12] Therefore, many efforts have been dedicated to apply ICAs in the board-assembly process as an interconnect material. While ICAs have many advantages over eutectic and lead-free solders, there are some technical challenges to overcome, such as unstable contact resistance under extremely humid conditions, low electrical conductivity, low impact strength, and low self-alignment capability.…”

Section: Introductionmentioning

confidence: 99%

Stabilizing contact resistance of isotropically conductive adhesives on various metal surfaces by incorporating sacrificial anode materials

Moon

Liong

et al. 2004

Journal of Elec Materi

View full text Add to dashboard Cite

The contact resistance stability of isotropically conductive adhesives (ICAs) on non-noble metal surfaces under the 85°C/85% relative humidity (RH) aging test was investigated. Previously, we demonstrated that galvanic corrosion has been shown as the main mechanism of the unstable contact resistance of ICAs on non-noble metal surfaces. A sacrificial anode was introduced into the ICA joint for cathodic protection. Zinc, chromium, and magnesium were employed in the ICA formulations as sacrificial anode materials that have much lower electrode-potential values than the metal pad surface, such as tin or tin-based alloys. The effect of particle sizes and loading levels of sacrificial anode materials were studied. Chromium was not as effective in suppressing corrosion as magnesium or zinc because of its strong tendency to self-passivate. The corrosion potential of ICAs was reduced by half with the addition of zinc and magnesium into the ICA formulation. The addition of zinc and magnesium was very effective in controlling galvanic corrosion that takes place in the ICA joints, resulting in stabilized contact resistance of ICAs on Sn, SnPb, and SnAgCu surfaces during the 85°C/85% RH aging test.

show abstract

“…Therefore, it is a promising material for substituting traditional solders. However, one critical problem associated with electrically conductive adhesives is that the contact resistance between the adhesive and a nonnoble metal surface tends to increase significantly during aging, particularly in high temperature atmospheres with high relative humidity (85 o C/85% RH), due to galvanic corrosion [4]- [6] . Graphene is a 2D material of only one atom layer thickness consisting of sp2 bonded carbon atoms arranged in a honeycomb lattice with extreme properties such as high thermal conductivity, high optical absorptivity, and high mechanical strength.…”

Section: C/85%mentioning

confidence: 99%

Preventing aging of electrically conductive adhesives on metal substrate using graphene based barrier

Yang

Huang

Yuan

et al. 2016

2016 China Semiconductor Technology International Conference (CSTIC)

View full text Add to dashboard Cite

Electrically conductive adhesives (ECAs) seem to be a promising substitute to traditional metal-based solders, because of they being environmentally friendly materials requiring much lower processing temperatures, and offering a much finer pitch. However, a critical problem related to the use of ECAs is that the contact resistance to the metal pad tends to increase significantly during aging tests due to galvanic corrosion, particularly in 85 o C/85% relative humidity (RH) atmospheres. In this respect the reported impermeability of graphene, a property prohibiting most molecules including water vapor from penetrating the film, has made graphene a major candidate as an anti-corrosion barrier material. The use of graphene as an anti-corrosion barrier material on steel and other metals has already been reported in literature. In this paper, the use of graphene-based barriers [12] between the ECA and the copper pads on a printed circuit board for alleviating the galvanic corrosion problem is reported.

show abstract

Evaluation of contact resistance for isotropic electrically conductive adhesives

Cited by 67 publications

References 6 publications

Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate

Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate

Stabilizing contact resistance of isotropically conductive adhesives on various metal surfaces by incorporating sacrificial anode materials

Preventing aging of electrically conductive adhesives on metal substrate using graphene based barrier

Contact Info

Product

Resources

About